8X2 MULTI-PORT SRAM, CDIP24
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| package instruction | DIP, |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| JESD-30 code | R-GDIP-T24 |
| memory density | 16 bi |
| Memory IC Type | MULTI-PORT SRAM |
| memory width | 2 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 24 |
| word count | 8 words |
| character code | 8 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8X2 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| SN74172J-00 | SN74172N-10 | SN74172N-00 | SN74172J | |
|---|---|---|---|---|
| Description | 8X2 MULTI-PORT SRAM, CDIP24 | 8X2 MULTI-PORT SRAM, PDIP24 | 8X2 MULTI-PORT SRAM, PDIP24 | IC 8 X 2 MULTI-PORT SRAM, CDIP24, Static RAM |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, | DIP, | DIP, | DIP, DIP24,.6 |
| Reach Compliance Code | unknow | unknown | unknown | _compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | R-GDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-GDIP-T24 |
| memory density | 16 bi | 16 bit | 16 bit | 16 bi |
| Memory IC Type | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
| memory width | 2 | 2 | 2 | 2 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 | 3 |
| Number of terminals | 24 | 24 | 24 | 24 |
| word count | 8 words | 8 words | 8 words | 8 words |
| character code | 8 | 8 | 8 | 8 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 8X2 | 8X2 | 8X2 | 8X2 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | NO | NO | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm |
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