2322 661 97...
Vishay BCcomponents
Surface Mount PTC Thermistors
For Overload Protection
FEATURES
•
•
•
•
•
•
Ideal for pick-and-place circuit assembly
Low mounting height
Suitable for reflow soldering
Small ceramic diameter for faster response
Low heat transfer to substrate
Flat terminations for stable positioning and good
solderability.
APPLICATIONS
QUICK REFERENCE DATA
VALUE
DESCRIPTION
Nominal R25
Resistance tolerance
Maximum overload current
(voltage dependent)
Non-trip current
Maximum voltage
Response time at 25
°
C and
20 W overload power
Matching
Maximum continuous power at
STANDARD
TYPES
(1)(2)
TELECOM
TYPES
(1)(2)
10
to
70
Ω
2
to
500
Ω
±
10%;
±
15%;
±
20%
2 to 10 A
50 to 500 mA 50 to 100 mA
at 25
°
C
at 70
°
C
16 to 400 V
(RMS)
220 to 600 V
( RMS)
<
1 s
−
down to 0.5
Ω
2W
•
Telecom
– Central office switching (C.O.)
– Subscriber terminal equipment (T.E.)
– Set top box
– Modems
– Cable TV communications
•
General industry and automotive
– Low power supplies overload protection
– Data bus protection.
DESCRIPTION
The component consists of a high-performance PTC
ceramic disc mounted in a lead-frame for direct soldering
onto a printed-circuit board (PCB) or substrate.
The ceramic is soldered to the leadframe by a local reflow
process, during which the solder layer is melted to the
metallized ceramic surface using a low residue flux.
Notes
1. Customized products are available on request.
2. Coated and/or reinforced types are available on request.
MARKING
•
All SMD PTCs are marked with the last 3-digits of the type
number and a date code (YYWW).
ELECTRICAL DATA AND ORDERING INFORMATION
R
25
(
Ω
)
(%)
V
MAX.
(V)
I
nt
at
25
°
C
70
°
C
I
t
at
25
°
C
MAX.
TRIP-TIME
t
t
(s)
at I
t
(mA)
MATCHED
PAIRS
AVAILABLE
CERAMIC
SIZE
(mm)
CATALOG
NUMBER
2322 661 .....
Telecommunication types; see note
1
40
25
265
80
50
130
2.5
500
(1)
15 to 20
−
300
150
100
250
1.5
1000
15 to 20
(1)
−
300
150
100
250
1.5
1000
25
(1)
20
265
120
70
220
1.3
1000
(1)
35
+15/
−
20
425
110
70
175
1.0
1000
10
(1)
20
245
165
100
270
3.0
1000
10
(1)
20
245
165
100
270
3.0
1000
20
(1)
20
300
120
70
250
1.4
1000
50
20
425
90
60
150
0.8
1000
General industrial types
25
60
150
100
300
4.0
600
9.4
(1)
3.3
(1)
25
24
400
−
650
6.0
1000
Note
1. These types pass
“ITU-T K20/21”
telecommunication protection recommendation.
no
0.5
Ω
no
1
Ω
1
Ω
no
0.5
Ω
0.5
Ω
1
Ω
−
−
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
97002
97003
97004
97005
97009
97012
97016
97018
97019
97011
97013
Document Number: 29068
Revision: 10-Oct-03
For technical questions contact: nlr.europe@vishay.com
www.vishay.com
147
2322 661 97...
Vishay BCcomponents
DIMENSIONS
in millimeters
2
3
Surface Mount PTC Thermistors
For Overload Protection
MATERIAL INFORMATION
REF.
1
2
3
DESCRIPTION
ceramic
metallization
leadframe
MATERIAL AND REMARKS
BaTiO3 doped
NiCr Ag layer
(vacuum deposition)
Ni plated phosphor bronze material
covered by PbSn8 solder layer
1
3
2
Product outline. See Material Information table.
HANDLING PRECAUTIONS
The special leadframe construction and the applied processes do not allow high handling forces on the component.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of
perspiration can influence component behaviour at high temperatures.
Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to
10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered
product.
For those applications where higher handling forces can be present, a re-inforced version is available on request.
PTC OUTLINES
PTC SMD ceramic size: 6.5 mm.
0
7.2
−0.2
8.0
3.45
±0.15
2
0.2
1
10°
max.
3.6
±0.1
7.6
±0.25
10
±0.25
0.6
+0.6
0
1.2
2.8
4
±0.2
For electrical data, see Electrical Data
and Ordering Information table.
4
±0.1
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with
“CECC 00802”
. Soldering processes which can be
used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260
°
C during 10 s should
not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
Reflow soldering.
300
10 s
260 C
250
245 C
215 C
200
180 C
40 s
10 s
200
180 C
Vapour phase soldering.
300
Dimensions of the solder lands in millimeters
T
( C)
T
( C)
250
215 C
20 to 40 s
2
150
150
130 C
130 C
external preheating
100 C
forced
cooling
5
100
2 K/s
50
100
50
internal preheating,
e.g. by infrared,
max. 2 K/s
11
0
0
50
100
150
200
t (s)
250
0
0
50
100
150
200
t (s)
250
Typical values (solid line).
Process limits (dotted lines).
Typical values (solid line).
Process limits (dotted line).
www.vishay.com
148
For technical questions contact: nlr.europe@vishay.com
Document Number: 29068
Revision: 10-Oct-03
2322 661 97...
Surface Mount PTC Thermistors
For Overload Protection
PACKAGING
TAPE SPECIFICATIONS
All tape and reel specifications are in accordance with
IEC 60286-3”
. Basic dimensions are given in Blister Tape and Reel
drawings, and Material Information and Electrical Data and Ordering Information tables. Carrier tape material is conductive
polystyrene or polycarbonate.
Blister tape.
K0
T
D0
P2
E
P0
Vishay BCcomponents
cover tape
B0
F
W
T1
T2
A0
P1
direction of unreeling
D1
Cumulative pitch error: 0.2 mm over 10 pitches.
Cumulative tolerance over 10 holes:
±0.2
mm.
Component orientation in the tape: large upper contact is
situated on the sprocket hole side, see Component
Orientation in the Tape drawing.
For dimensions see Dimensions of Blister Tape table.
DIMENSIONS OF BLISTER TAPE
in millimeters
SYMBOL
A
0
; note 1
B
0
; note 1
K
0
W
E
F
D
0
D
1
P
0
; note 2
P
1
P
2
T tape thickness
T
1
cover tape
T
2
Notes
1. Measured 0.3 mm above base pocket.
2. P
0
pitch tolerance over any 10 pitches is
±
0.2 mm.
PRODUCT SIZE CODE
7.5
10.5
4.1
16
1.75
7.5
1.5
1.5
4
12
2
0.3
0.05
4.6
TOL.
±
0.1
±
0.1
±
0.1
±
0.3
±
0.1
±
0.1
+0.1/
−
0.0
+0.1/
−
0.0
±
0.1
±
0.1
±
0.1
±
0.03
−
max.
Component orientation in the tape.
005
0104
005
0104
005
0104
Document Number: 29068
Revision: 10-Oct-03
For technical questions contact: nlr.europe@vishay.com
www.vishay.com
149
2322 661 97...
Vishay BCcomponents
Surface Mount PTC Thermistors
For Overload Protection
LEADER/TRAILER TAPE SPECIFICATION
Leader/trailer tape.
trailer end
leader end
empty compartments
with cover tape
(min. 240 mm)
cover tape only
trailer (min. 160 mm)
leader
≥400
mm
CCB838
TAPING PACKAGE REQUIREMENTS
Component is free and not sticking to top and/or bottom tape.
Component should be easy to remove from carrier tape.
PEEL-OFF FORCE
Peel-off force of blister tape is in accordance with
“IEC 60286-3”
; that is, 0.1 to 1.3 N at a peel-off speed of 300 mm/minute.
Peel-off force.
peeling direction
top cover tape
10°
CCB289
carrier tape
REEL SPECIFICATIONS
in millimeters
Reel.
W2
20.5
12.75
0.15
N
0
A
For reel dimensions see Electrical Data and Ordering Information table.
W1
REEL DIMENSIONS
in millimeters
PRODUCT SIZE
CODE
4028
Notes
1. Reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres.
2. For matched components it is possible to have a maximum of one incomplete reel per resistance group.
The minimum packaging quantity will be 500 units, with an even 100 up to 1400.
www.vishay.com
150
For technical questions contact: nlr.europe@vishay.com
Document Number: 29068
Revision: 10-Oct-03
UNITS
(2)
PER REEL
1500
TAPE WIDTH
16
A
330
N
62
W
1
16.4
W
2
MAX.
20.4
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