DEVELOPMENTAL TECHNICAL DATASHEET
THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND
®
2815A die attach adhesive offers high
thermal conductivity to minimize thermal resistance
between the chip and substrate. This adhesive is
FEATURES
• Excellent thermal and electrical conductivity
• Good dispensability and good fillet formation
• Good performance on Ag/Cu leadframes
• Low moisture absorption
ABLEBOND
®
2815A
designed to provide improved workability for applica-
tions requiring high heat extraction from die.
Typical Uncured Properties
Filler Type
Viscosity @ 25ºC
Thixotropic Index
Work Life @ 25ºC
Est Storage Life @ -40ºC
Cure Process Data
Weight Loss on Cure
Recommended Cure Condition
PHYSIOCHEMICAL PROPERTIES
- Post Cure
Ionics
Chloride
Sodium
Potassium
ABLEBOND 2815A
Silver
8000 cP
5.6
24 hours
1 year
ABLEBOND 2815A
6.8%
Test Description
Test
Method
ATM-0018
ATM-0089
ATM-0087
ATM-0068
Test
Method
ATM-0031
Test
Method
ATM-0007
ATM-0044
ATM-0002
ATM-0058
ATM-0055
Brookfield CP51 @ 5 rpm
Viscosity @ 0.5/Viscosity @ 5 rpm
25% increase in viscosity @ RT
Test Description
10 x 10 mm Si die on glass slide
30 min ramp RT to 200ºC + 30 min @ 200ºC in N
2
oven
ABLEBOND 2815A
< 10 ppm
< 10 ppm
< 10 ppm
70 µmhos/cm
3.5
63ºC
64 ppm/ºC
122 ppm/ºC
Test Description
Teflon flask, 5 gm sample/20-40
mesh, 50 gm DI water, 100ºC for
24 hours
Conductometer
pH meter
TMA penetration mode
TMA expansion mode
Water Extract Conductivity
pH
Glass Transition Temperature
Coefficient of Thermal Expansion
Below Tg
Above Tg
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our Standard Release Specification.
This is a developmental product that has been converted to high volume manufacturing and is being monitored for process stability. During this
monitoring period, certain properties may be adjusted slightly.
09/03
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2815A
PHYSIOCHEMICAL PROPERTIES
- Post Cure
Dynamic Tensile Modulus
@-65ºC
@ 25ºC
@ 150ºC
@ 250ºC
Moisture Absorption @ Saturation
THERMAL/ELECTRICAL
PROPERTIES - Post Cure
Thermal Conductivity
Volume Resistivity
Bond Joint Resistance
MECHANICAL PROPERTIES -
Post Cure
Die Shear Strength @ 25ºC
Die Shear Strength (kg
f
/die) vs.
Temperature
Chip Warpage @ 25ºC vs. Chip
Size
ABLEBOND 2815A
Test Description
Test
Method
9900 MPa (1,400,000 psi) Dynamic mechanical thermal
5700 MPa (830,000 psi) analysis (DMTA) using <0.5mm thick
1800 MPa (260,000 psi) sample
1600 MPa (230,000 psi)
0.24%
ABLEBOND 2815A
20 W/mK
0.00004 ohm-cm
0.0002ohms
ABLEBOND 2815A
5.8 kg
f
/die
@25ºC
12.3
@200ºC
4.0
Chip Size
7.6x7.6mm (300 x 300 mil)
12.7x12.7mm (500x500mil)
Dynamic vapor sorption after 85ºC/
85% RH exposure
Test Description
Laser Flash
4-point probe
200 x 200 mil Cu/Cu,
6.4 µm bondline thickness
Test Description
2 x 2mm (80 x 80 mil) Si die on
Ag/Cu leadframe
@250ºC
3.4
3 x 3 mm (120 x 120 mil) Si
die on Ag/Cu leadframe
0.38mm (15mil) thick
Si die on 0.2mm thick
Ag/Cu LF
ATM-0112
ATM-0093
Test
Method
ATM-0116
ATM-0020
ATM-0032
Test
Method
ATM-0052
ATM-0052
Warpage
9.7
µm
37.6
µm
ATM-0059
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2815A
APPLICATION GUIDELINES
SHIPMENT
This Ablestik product is packed and shipped in dry ice at
–80ºC. Inside every dry ice shipment of Ablestik’s products
is a small packet containing the ABLECUBE. This is a
small blue cube which retains its shape at –40ºC. If the
ABLECUBE is exposed to temperatures higher than –40ºC,
the cube will melt.
Please check the state of the ABLECUBE to ensure the
integrity of the shipment. If the ABLECUBE has melted upon
Receiving inspection, place the entire shipment in a –40ºC
freezer and contact your Ablestik Customer Service or Sales
Representative.
UNPACKING
Transfer the syringes from the dry ice to a –40ºC freezer
without ANY delays. Freeze-thaw voids will form in the
syringes if the syringes are repeatedly thawed and refrozen.
STORAGE
This Ablestik product must be stored at –40ºC. The shelf
life of the material is only valid when the material has been
stored at the specified storage condition. Incorrect storage
conditions will degrade the performance of the material in
both handling (e.g. dispensing or screen printing) and final
cured properties.
THAWING
Allow the container to reach room temperature before use.
After removing from the freezer, set the syringes to stand
vertically while thawing. Refer to the Syringe Thaw Time
chart for the thaw time recommendation.
DO NOT open the container before contents reach ambient
temperature. Any moisture that collects on the thawed
container should be removed prior to opening the container.
DO NOT re-freeze. Once thawed to room temperature, the
adhesive should not be re-frozen.
ADHESIVE APPLICATION
Thawed adhesive should be immediately placed on
dispense equipment for use. If the adhesive is transferred
to a final dispensing reservoir, care must be exercised
to avoid entrapment of contaminants and/or air into the
adhesive.
Adhesive must be completely used within the product’s
recommended work life of 24 hours.
Apply enough adhesive to achieve a 25-50
µm
(1-2 mil)
wet bondline thickness, dispensed with approximately 25%
- 50% filleting on all sides of the die. Alternate dispense
amounts may be used depending on the application
requirements. Star or crossed shaped dispense patterns
will yield fewer bondline voids than the matrix style of
dispense pattern.
Contact your Ablestik Technical Service Department
for detailed recommendation on adhesive application,
including dispensing.
AVAILABILITY
ABLEBOND
®
adhesives are packaged in syringes or jars
per customer specification. Available package sizes range
from 1cc to 30cc and 1 ounce to 1 pound. For details, refer
to the Ablestik Standard Package Data Set or contact your
Customer Service Representative.
20021 Susana Road, Rancho Dominguez, CA 90221
(310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783
The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every case we recommend that purchasers before
using any product conduct their own tests to determine whether the product is suitable for their particular purposes under their own operating conditions. No representative of ours has any
authority to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained
herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without
the authority from the owner of this patent. These materials are not designed or manufactured for implantation in the human body. Approval from FDA for such use as part of any product
to be implanted in the human body has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American Chemistry
Council’s Responsible Care
®
program.
For a technical contact nearest you, visit
www.ablestik.com
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