MASK ROM, 32KX8, 150ns, CMOS, CDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Vishay |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknow |
| Maximum access time | 150 ns |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| memory density | 262144 bi |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 32KX8 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum standby current | 0.001 A |
| Maximum slew rate | 0.025 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 883/23C256MD | SCM23C256E-2 | SCM23C256E-3 | 883/23C256MC | SCM23C256C-1 | SCM23C256C-2 | SCM23C256C-3 | SCM23C256E-1 | SCM23C256MC | |
|---|---|---|---|---|---|---|---|---|---|
| Description | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | Memory IC | Memory IC | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | MASK ROM, 32KX8, 100ns, CMOS, CDIP28 | MASK ROM, 32KX8, 120ns, CMOS, CDIP28 | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | MASK ROM, 32KX8, 100ns, CMOS, PDIP28 | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 |
| package instruction | DIP, DIP28,.6 | , | , | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| Is it Rohs certified? | incompatible | - | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Vishay | - | - | Vishay | Vishay | Vishay | Vishay | Vishay | Vishay |
| Maximum access time | 150 ns | - | - | 150 ns | 100 ns | 120 ns | 150 ns | 100 ns | 150 ns |
| JESD-30 code | R-XDIP-T28 | - | - | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 |
| JESD-609 code | e0 | - | - | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 262144 bi | - | - | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi |
| Memory IC Type | MASK ROM | - | - | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | - | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | - | - | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 32768 words | - | - | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | - | - | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Maximum operating temperature | 125 °C | - | - | 125 °C | 70 °C | 70 °C | 85 °C | 70 °C | 125 °C |
| organize | 32KX8 | - | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Package body material | CERAMIC | - | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | - | - | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | - | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.001 A | - | - | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| Maximum slew rate | 0.025 mA | - | - | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
| Nominal supply voltage (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | - | - | NO | NO | NO | NO | NO | NO |
| technology | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | - | - | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |