MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Vishay Beyschlag
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
FEATURES
• Superior moisture resistivity, |ΔR/R| < 0.5 %
(85 °C; 85 % RH; 1000 h)
• Rated dissipation
P
70
up to 0.4 W for size 1206
• AEC-Q200 qualified
• Approved according to EN 140401-801
• Lead (Pb)-free solder contacts
• Compliant to RoHS directive 2002/95/EC
APPLICATIONS
• Automotive
• Telecommunication
• Medical equipment
Automotive-Grade MC AT Precision Thin Film Chip
Resistors are the perfect choice for most fields of modern
precision electronics where reliability and stability is of major
concern. Typical applications include automotive,
telecommunication, industrial, medical equipment, precision
test and measuring equipment.
• Industrial equipment
METRIC SIZE
INCH:
METRIC:
0402
RR 1005M
0603
RR 1608M
0805
RR 2012M
1206
RR 3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION
Metric size
Resistance range
Resistance tolerance
Temperature coefficient
Rated dissipation
P
70 (1)
Operating voltage,
U
max.
AC/DC
Permissible film temperature
(1)
Insulation voltage
1 min;
U
ins
Continuous
75 V
75 V
100 V
75 V
200 V
75 V
300 V
75 V
0.063 W
50 V
MCS 0402 AT
RR 1005M
47
Ω
to 47 kΩ
MCT 0603 AT
RR 1608M
47
Ω
to 100 kΩ
± 0.1 %
± 25 ppm/K; ± 15 ppm/K
0.125 W
75 V
155 °C
0.200 W
150 V
0.400 W
200 V
MCU 0805 AT
RR 2012M
47
Ω
to 100 kΩ
MCA 1206 AT
RR 3216M
47
Ω
to 100 kΩ
Note
(1)
Please refer to APPLICATION INFORMATION below
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1
For technical questions, contact:
thinfilmchip@vishay.com
Document Number: 28785
Revision: 19-Nov-09
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support
of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not
exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint,
hence special solder alloys or board materials may be required to maintain the reliability of the assembly.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and
temperature limits in order to maintain a desired stability.
Vishay Beyschlag
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
Operation mode
Rated dissipation
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
Film temperature
Max. resistance change at rated dissipation for
resistance range:
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
|ΔR/R|
max., after:
1000 h
8000 h
225 000 h
≤
0.1 %
≤
0.2 %
≤
0.6 %
≤
0.2 %
≤
0.4 %
-
47
Ω
to 47 kΩ
47
Ω
to 100 kΩ
47
Ω
to 100 kΩ
47
Ω
to 100 kΩ
47
Ω
to 47 kΩ
47
Ω
to 100 kΩ
47
Ω
to 100 kΩ
47
Ω
to 100 kΩ
Standard
P
70
0.063 W
0.100 W
0.125 W
0.250 W
125 °C
Power
P
70
0.100 W
0.125 W
0.200 W
0.400 W
155 °C
Document Number: 28785
Revision: 19-Nov-09
For technical questions, contact:
thinfilmchip@vishay.com
www.vishay.com
2
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
DIMENSIONS
Vishay Beyschlag
T
1
W
W
T
H
T
2
L
DIMENSIONS AND MASS
TYPE
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
H
(mm)
0.32 ± 0.05
0.45 + 0.1/- 0.05
0.52 ± 0.1
0.55 ± 0.1
L
(mm)
1.0 ± 0.05
1.55 ± 0.05
2.0 ± 0.1
3.2 + 0.1/- 0.2
W
(mm)
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
W
T
(mm)
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
T
1
(mm)
0.2 + 0.1/- 0.15
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
T
2
(mm)
0.2 ± 0.1
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
MASS
(mg)
0.6
1.9
4.6
9.2
SOLDER PAD DIMENSIONS
G
Y
Z
X
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE
G
(mm)
-
0.55
0.80
1.40
Y
(mm)
-
1.10
1.25
1.50
X
(mm)
-
1.10
1.50
1.90
Z
(mm)
-
2.75
3.30
4.40
G
(mm)
0.35
0.65
0.90
1.50
REFLOW SOLDERING
Y
(mm)
0.55
0.70
0.90
1.15
X
(mm)
0.55
0.95
1.40
1.75
Z
(mm)
1.45
2.05
2.70
3.80
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the
reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent
conductor areas.
Document Number: 28785
Revision: 19-Nov-09
For technical questions, contact:
thinfilmchip@vishay.com
www.vishay.com
4
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
Vishay Beyschlag
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade (Al
2
O
3
) ceramic substrate and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics. The resistor elements are covered
by a unique protective coating designed for electrical,
mechanical and climatic protection. The terminations receive
a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with
IEC 60286-3
(3)
.
Precision Thin Film Chip Resistor
Superior Moisture Resistivity
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification
EN 140401-801
which refers to
EN 60115-1,
EN 140400
and the variety of environmental test procedures
of the
IEC 60068
(3)
series. The detail specification refers to
the climatic categories 55/125/56, which relates to the
“standard operation mode” of this datasheet.
Conformity is attested by the use of the CECC Logo (
) as
the Mark of Conformity on the package label. For
MCS 0402 AT and products with TCR 15 ppm/K the
certification according to DIN EN 140401-801:2008-05 is
pending.
Vishay BEYSCHLAG has achieved
“Approval of
Manufacturer”
in accordance with
IEC QC 001002-3,
clause 2.
The release certificate for
“Technology Approval
Schedule”
in accordance with
CECC 240001
based on
IEC QC 001002-3, clause 6
is granted for the
Vishay BEYSCHLAG manufacturing process.
The resistors are qualified according to AEC-Q200.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in
IEC 61760-1
(3)
. The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS compliant; the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the
GADSL
(1)
and the
CEFIC-EECA-EICTA
(2)
list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2002/95/EC Restriction of the
Substances directive (RoHS)
use
of
Hazardous
RELATED PRODUCTS
For more information about products with higher operation
temperature please refer to the
professional
datasheet
document no.
28760.
Chip resistor arrays
may be used in sensing applications or
precision amplifiers where close matching between multiple
resistors
is
necessary.
Please
refer
to
the
ACAS AT - Precision datasheet document no.
28770.
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Notes
(1)
Global Automotive Declarable Substance List, see
www.gadsl.org
(2)
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see
www.eicta.org/index.php?id=995
→
issues
→
environment policy
→
chemicals
→
chemicals for electronics
(3)
The quoted IEC standards are also released as EN standards with the same number and identical contents
www.vishay.com
5
For technical questions, contact:
thinfilmchip@vishay.com
Document Number: 28785
Revision: 19-Nov-09
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