30050-33 datasheet, PDF - EEWORLD Datasheet

30050-33: DescriptionGeodeâ¢ GXm Processor Integrated x86 Solution with MMX Support; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，244 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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30050-33 Overview

Geodeâ¢ GXm Processor Integrated x86 Solution with MMX Support

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	SPGA, SPGA320,37X37
Reach Compliance Code	unknow
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	32
bit size	32
boundary scan	YES
External data bus width	32
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CPGA-P320
JESD-609 code	e0
length	49.595 mm
low power mode	YES
Number of terminals	320
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SPGA
Encapsulate equivalent code	SPGA320,37X37
Package shape	SQUARE
Package form	GRID ARRAY, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.9,3.3 V
Certification status	Not Qualified
Maximum seat height	3.07 mm
speed	233 MHz
Maximum slew rate	2850 mA
Maximum supply voltage	3.05 V
Minimum supply voltage	2.75 V
Nominal supply voltage	2.9 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	1.27 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	49.595 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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