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W29N08GVBJAF

Description
Flash,
Categorystorage    storage   
File Size2MB,79 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

W29N08GVBJAF Overview

Flash,

W29N08GVBJAF Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
package instructionVFBGA,
Reach Compliance Codecompli
JESD-30 codeR-PBGA-B63
length11 mm
memory density8589934592 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals63
word count1073741824 words
character code1000000000
Operating modeASYNCHRONOUS
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
organize1GX8
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage3.3 V
Maximum seat height1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
typeSLC NAND TYPE
width9 mm
W29N08GVXXAF
2 CHIP STACKED 8G-BIT
W29N08GVXXAF
8G-BIT 3.3V
NAND FLASH MEMORY
1
Release Date: September 27
th
, 2018
Revision B

W29N08GVBJAF Related Products

W29N08GVBJAF W29N08GVSJAF
Description Flash, Flash,
Maker Winbond Electronics Corporation Winbond Electronics Corporation
package instruction VFBGA, TSOP1,
Reach Compliance Code compli compli
JESD-30 code R-PBGA-B63 R-PDSO-G48
length 11 mm 18.4 mm
memory density 8589934592 bi 8589934592 bi
Memory IC Type FLASH FLASH
memory width 8 8
Number of functions 1 1
Number of terminals 63 48
word count 1073741824 words 1073741824 words
character code 1000000000 1000000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 105 °C 105 °C
Minimum operating temperature -40 °C -40 °C
organize 1GX8 1GX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA TSOP1
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming voltage 3.3 V 3.3 V
Maximum seat height 1 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING
Terminal pitch 0.8 mm 0.5 mm
Terminal location BOTTOM DUAL
type SLC NAND TYPE SLC NAND TYPE
width 9 mm 12 mm

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