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IDT72T51546L7-5BB

Description
FIFO, 32KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Categorystorage    storage   
File Size215KB,13 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT72T51546L7-5BB Overview

FIFO, 32KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72T51546L7-5BB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts256
Reach Compliance Code_compli
ECCN codeEAR99
period time7.5 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
memory density1179648 bi
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals256
word count32768 words
character code32000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height3.5 mm
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width17 mm
2.5V MULTI-QUEUE FIFO (32 QUEUES)
36 BIT WIDE CONFIGURATION
1,179,648 bits
2,359,296 bits
ADVANCE INFORMATION
IDT72T51546
IDT72T51556
FEATURES:
Choose from among the following memory density options:
IDT72T51546
Total Available Memory = 1,179,648 bits
IDT72T51556
Total Available Memory = 2,359,296 bits
Configurable from 1 to 32 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 256 x 36
Independent Read and Write access per queue
User programmable via serial port
User selectable I/O: 2.5V LVTTL, 1.5V HSTL, 1.8V eHSTL
Default Multi-Queue device configurations
– IDT72T51546 : 1,024 x 36 x 32Q
– IDT72T51556 : 2,048 x 36 x 32Q
100% Bus Utilization, Read and Write on every clock cycle
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Echo Read Enable & Echo Read Clock Outputs
Individual, Active queue flags (OV,
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Shows
PAE
and
PAF
status of 8 Queues
Direct or polled operation of flag status bus
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
– x36in to x36out
– x18in to x36out
– x9in to x36out
– x36in to x18out
– x36in to x9out
FWFT mode of operation on read port
Packet Ready mode of operation
Partial Reset, clears data in single Queue
Expansion of up to 8 Multi-Queue devices in parallel is available
Power Down Input provides additional power savings in HSTL
and eHSTL modes.
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
DATA PATH FLOW DIAGRAM
MULTI-QUEUE FIFO
WADEN
FSTR
WRADD
8
Q0
READ CONTROL
8
RADEN
ESTR
RDADD
REN
RCLK
WRITE CONTROL
Q1
WEN
WCLK
EREN
ERCLK
OE
Q2
Din
Qout
x36
DATA IN
FF
PAF
PAFn
x36
DATA OUT
READ FLAGS
OV
PR
PAE
PAEn
8
WRITE FLAGS
Qmax
8
PRn
5998 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2001
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
OCTOBER 2, 2001
DSC-5998/-

IDT72T51546L7-5BB Related Products

IDT72T51546L7-5BB IDT72T51556L7-5BB IDT72T51556L7-5BBI IDT72T51546L7-5BBI IDT72T51556L6BB IDT72T51546L6BBI IDT72T51556L5BB
Description FIFO, 32KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA BGA BGA BGA BGA
package instruction BGA, BGA, BGA, BGA, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 BGA, BGA,
Contacts 256 256 256 256 256 256 256
Reach Compliance Code _compli not_compliant not_compliant not_compliant _compli _compli _compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
period time 7.5 ns 7.5 ns 7.5 ns 7.5 ns 6 ns 6 ns 5 ns
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
memory density 1179648 bi 2359296 bit 2359296 bit 1179648 bit 2359296 bi 1179648 bi 2359296 bi
memory width 36 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1
Number of terminals 256 256 256 256 256 256 256
word count 32768 words 65536 words 65536 words 32768 words 65536 words 32768 words 65536 words
character code 32000 64000 64000 32000 64000 32000 64000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C 70 °C
organize 32KX36 64KX36 64KX36 32KX36 64KX36 32KX36 64KX36
Exportable YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20 20 20 20 20
width 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
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