IDT72V265L20PFT/R datasheet, PDF

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IDT72V265L20PFT/R: DescriptionFIFO, 16KX18, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64; Categorystorage storage; File Size1MB，30 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT72V265L20PFT/R Overview

FIFO, 16KX18, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64

IDT72V265L20PFT/R Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	QFP
package instruction	LQFP,
Contacts	64
Reach Compliance Code	compli
ECCN code	EAR99
Other features	RETRANSMIT
period time	20 ns
JESD-30 code	S-PQFP-G64
JESD-609 code	e0
length	14 mm
memory density	294912 bi
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of terminals	64
word count	16384 words
character code	16000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX18
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	14 mm

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Description	FIFO, 16KX18, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64	FIFO, 8KX18, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64	FIFO, 8KX18, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64	FIFO, 16KX18, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64	FIFO, 8KX18, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64	FIFO, 8KX18, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64	FIFO, 16KX18, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64	FIFO, 16KX18, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	LQFP,	10 X 10, 1.40 MM HEIGHT, STQFP-64	10 X 10, 1.40 MM HEIGHT, STQFP-64	LQFP,	14 X 14 MM, 1.40 MM HEIGHT, TQFP-64	14 X 14 MM, 1.40 MM HEIGHT, TQFP-64	10 X 10, 1.40 MM HEIGHT, STQFP-64	LFQFP,
Contacts	64	64	64	64	64	64	64	64
Reach Compliance Code	compli	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
period time	20 ns	15 ns	20 ns	15 ns	15 ns	20 ns	15 ns	20 ns
JESD-30 code	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	14 mm	10 mm	10 mm	14 mm	14 mm	14 mm	10 mm	10 mm
memory density	294912 bi	147456 bit	147456 bit	294912 bit	147456 bit	147456 bit	294912 bit	294912 bit
memory width	18	18	18	18	18	18	18	18
Humidity sensitivity level	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	64	64	64	64	64	64	64	64
word count	16384 words	8192 words	8192 words	16384 words	8192 words	8192 words	16384 words	16384 words
character code	16000	8000	8000	16000	8000	8000	16000	16000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16KX18	8KX18	8KX18	16KX18	8KX18	8KX18	16KX18	16KX18
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LFQFP	LFQFP	LQFP	LQFP	LQFP	LFQFP	LFQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240	240	240	240	240
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	20	20	20	20	20	20	20	20
width	14 mm	10 mm	10 mm	14 mm	14 mm	14 mm	10 mm	10 mm
Maker	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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