IDT74FCT162H272ETEG datasheet, PDF

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IDT74FCT162H272ETEG: DescriptionBus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56; Categorylogic logic; File Size185KB，8 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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IDT74FCT162H272ETEG Overview

Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56

IDT74FCT162H272ETEG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	DFP
package instruction	0.635 MM PITCH, CERPACK-56
Contacts	56
Reach Compliance Code	compli
Other features	SYNCHRONOUS O/P ENABLES; COMMON CLOCK ENABLE FOR EACH REGISTER; BUS HOLD I/PS
series	FCT
JESD-30 code	R-GDFP-F56
JESD-609 code	e3
length	18.415 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS EXCHANGER
Number of digits	12
Number of functions	1
Number of ports	3
Number of terminals	56
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE WITH SERIES RESISTOR
Output polarity	TRUE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	260
propagation delay (tpd)	5 ns
Certification status	Not Qualified
Maximum seat height	2.413 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	FLAT
Terminal pitch	0.635 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	9.652 mm

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Description	Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56	Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, PDSO56, 0.40 MM PITCH, TVSOP-56	Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56	Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56	Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, PDSO56, 0.40 MM PITCH, TVSOP-56	Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, PDSO56, 0.40 MM PITCH, TVSOP-56
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	DFP	SSOP	DFP	DFP	SSOP	SSOP
package instruction	0.635 MM PITCH, CERPACK-56	0.40 MM PITCH, TVSOP-56	0.635 MM PITCH, CERPACK-56	0.635 MM PITCH, CERPACK-56	0.40 MM PITCH, TVSOP-56	0.40 MM PITCH, TVSOP-56
Contacts	56	56	56	56	56	56
Reach Compliance Code	compli	compliant	compliant	compliant	compliant	compliant
series	FCT	FCT	FCT	FCT	FCT	FCT
JESD-30 code	R-GDFP-F56	R-PDSO-G56	R-GDFP-F56	R-GDFP-F56	R-PDSO-G56	R-PDSO-G56
JESD-609 code	e3	e3	e3	e3	e3	e3
length	18.415 mm	11.3 mm	18.415 mm	18.415 mm	11.3 mm	11.3 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS EXCHANGER	BUS EXCHANGER	BUS EXCHANGER	BUS EXCHANGER	BUS EXCHANGER	BUS EXCHANGER
Number of digits	12	12	12	12	12	12
Number of functions	1	1	1	1	1	1
Number of ports	3	3	3	3	3	3
Number of terminals	56	56	56	56	56	56
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE WITH SERIES RESISTOR	3-STATE WITH SERIES RESISTOR	3-STATE WITH SERIES RESISTOR	3-STATE WITH SERIES RESISTOR	3-STATE WITH SERIES RESISTOR	3-STATE WITH SERIES RESISTOR
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DFP	TSSOP	DFP	DFP	TSSOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	FLATPACK	FLATPACK	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
propagation delay (tpd)	5 ns	5.4 ns	5.4 ns	6 ns	6 ns	5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.413 mm	1.2 mm	2.413 mm	2.413 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	Matte Tin (Sn) - annealed	MATTE TIN	MATTE TIN	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	FLAT	GULL WING	FLAT	FLAT	GULL WING	GULL WING
Terminal pitch	0.635 mm	0.4 mm	0.635 mm	0.635 mm	0.4 mm	0.4 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30
width	9.652 mm	4.4 mm	9.652 mm	9.652 mm	4.4 mm	4.4 mm

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