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BZD27C18P-TP

Description
Zener Diode, 18V V(Z), 5%, 0.8W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size460KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

BZD27C18P-TP Overview

Zener Diode, 18V V(Z), 5%, 0.8W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-2

BZD27C18P-TP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionROHS COMPLIANT, PLASTIC PACKAGE-2
Contacts2
Reach Compliance Code_compli
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeR-PDSO-F2
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.8 W
Nominal reference voltage18 V
surface mountYES
technologyZENER
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current25 mA
MCC
Micro Commercial Components
TM
Features
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
BZD27C6V2P
THRU
BZD27C200P
0.8 Watt
Zener Diode
6.2V - 200V Volts
SOD-123FL
A
B
High Surge Capability
Low profile surface-mount package.
Zener and TVS specification.
Maximum Ratings
Ideally Suited for Automatic Assembly
Standard V
Z
Tolerance is
+/-
5%
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Storage Temperature Range(T
STG
): -65
Operating Temperature Range(T
j
): -65
to +175
to +175
C
E
Zener Curren
Power Dissipation
Symbol
I
ZM
o
Value
Pd/Vz
Units
mA
@TL=105 C
o
@TA=25 C
P
tot
VF
RthJL
RthJA
2.3
0.8
1.2
30
188
W
V
o
o
H
D
Forward Voltage@I
F
= 200mA
Junction to
Lead
Thermal resistance
Non-repetitive peak
pulse power dissipation
with 100
µ
s square pulse
C/W
G
C/W
P
ZSM
P
RSM
300
150
W
W
DIM
A
B
C
D
E
G
H
Non-repetitive peak
pulse power dissipation
with 10/1000
µ
s waveform
Note :1.High Temperature Solder Exemptions Applied,See EU Directive Annex 7.
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.140
.152
3.55
3.85
.100
.112
2.55
2.85
.055
.071
1.40
1.80
.037
.053
0.95
1.35
.020
.039
0.50
1.00
.010
-----
0.25
-----
-----
.008
----
.20
SUGGESTED SOLDER
PAD LAYOUT
0.093”
NOTE
0.048”
0.036”
Revision:
B
www.mccsemi.com
1 of
5
2011/09/19

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