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74HCT2G16GW

Description
Buffer, HC/UH Series, 2-Func, 1-Input, CMOS, PDSO6
Categorylogic    logic   
File Size149KB,15 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HCT2G16GW Overview

Buffer, HC/UH Series, 2-Func, 1-Input, CMOS, PDSO6

74HCT2G16GW Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNexperia
package instructionSC-88, 6 PIN
Reach Compliance Codecompli
seriesHCT
JESD-30 codeR-PDSO-G6
JESD-609 codee3
length2 mm
Logic integrated circuit typeBUFFER
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
propagation delay (tpd)29 ns
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width1.25 mm
74HC2G16; 74HCT2G16
Dual buffer gate
Rev. 1 — 2 November 2015
Product data sheet
1. General description
The 74HC2G16; 74HCT2G16 is a high-speed Si-gate CMOS device.
The 74HC2G16; 74HCT2G16 provides two buffers.
2. Features and benefits
Wide supply voltage range from 2.0 V to 6.0 V
Complies with JEDEC standard no. 7A
High noise immunity
ESD protection:
HBM JESD22-A114-D exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Low power dissipation
Balanced propagation delays
Unlimited input rise and fall times
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC2G16GW
74HC2G16GV
74HCT2G16GW
74HCT2G16GV
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
Name
SC-88
SC-74
SC-88
SC-74
Description
plastic surface-mounted package; 6 leads
plastic surface-mounted package (TSOP6); 6 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package (TSOP6); 6 leads
Version
SOT363
SOT457
SOT363
SOT457
Type number
4. Marking
Table 2.
Marking
Marking code
P6
P6
U6
U6
Type number
74HC2G16GW
74HC2G16GV
74HCT2G16GW
74HCT2G16GV

74HCT2G16GW Related Products

74HCT2G16GW 74HC2G16GV 74HCT2G16GV 74HC2G16GW
Description Buffer, HC/UH Series, 2-Func, 1-Input, CMOS, PDSO6 Buffer, HC/UH Series, 2-Func, 1-Input, CMOS, PDSO6 Buffer, HC/UH Series, 2-Func, 1-Input, CMOS, PDSO6 Buffer, HC/UH Series, 2-Func, 1-Input, CMOS, PDSO6
Is it Rohs certified? conform to conform to conform to conform to
package instruction SC-88, 6 PIN SC-74, 6 PIN SC-74, 6 PIN SC-88, 6 PIN
Reach Compliance Code compli compliant compliant compliant
series HCT HC/UH HCT HC/UH
JESD-30 code R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6
JESD-609 code e3 e3 e3 e3
length 2 mm 2.9 mm 2.9 mm 2 mm
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER
Humidity sensitivity level 1 1 1 1
Number of functions 2 2 2 2
Number of entries 1 1 1 1
Number of terminals 6 6 6 6
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSOP TSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
propagation delay (tpd) 29 ns 125 ns 29 ns 125 ns
Maximum seat height 1.1 mm 1.1 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 6 V 5.5 V 6 V
Minimum supply voltage (Vsup) 4.5 V 2 V 4.5 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.95 mm 0.95 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 1.25 mm 1.5 mm 1.5 mm 1.25 mm

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