EPROM, 32KX8, 450ns, CMOS, CDIP28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | VLSI |
| Reach Compliance Code | unknow |
| Maximum access time | 450 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| memory density | 262144 bi |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Programming voltage | 12.5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| VM27C256-45CMB | VM27C256-25KMB | VM27C256-20KMB | VM27C256-20AMB | VM27C256-25CMB | VM27C256-35AMB | VM27C256-35CMB | VM27C256-35KMB | |
|---|---|---|---|---|---|---|---|---|
| Description | EPROM, 32KX8, 450ns, CMOS, CDIP28, | EPROM, 32KX8, 250ns, CMOS, CQCC32, | EPROM, 32KX8, 200ns, CMOS, CQCC32, | EPROM, 32KX8, 200ns, CMOS, CDIP28, | UVPROM, 32KX8, 250ns, CMOS, CDIP28, | EPROM, 32KX8, 350ns, CMOS, CDIP28, | EPROM, 32KX8, 350ns, CMOS, CDIP28, | EPROM, 32KX8, 350ns, CMOS, CQCC32, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 450 ns | 250 ns | 200 ns | 200 ns | 250 ns | 350 ns | 350 ns | 350 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XDIP-T28 | R-XQCC-N32 | R-XQCC-N32 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XQCC-N32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 262144 bi | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 32 | 32 | 28 | 28 | 28 | 28 | 32 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | QCCN | QCCN | DIP | DIP | DIP | DIP | QCCN |
| Encapsulate equivalent code | DIP28,.6 | LCC32,.45X.55 | LCC32,.45X.55 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LCC32,.45X.55 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | NO | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| Maker | VLSI | - | - | - | VLSI | VLSI | VLSI | VLSI |