AGLN030V5-ZQN68 datasheet, PDF

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AGLN030V5-ZQN68: DescriptionField Programmable Gate Array, 768 CLBs, 30000 Gates, 250MHz, 768-Cell, CMOS, 8 X 8 MM, 0.9 MM HEIGHT, 0.4 MM PITCH, QFN-68; CategoryProgrammable logic devices Programmable logic; File Size4MB，140 Pages; ManufacturerActel; Websitehttp://www.actel.com/

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AGLN030V5-ZQN68 Overview

Field Programmable Gate Array, 768 CLBs, 30000 Gates, 250MHz, 768-Cell, CMOS, 8 X 8 MM, 0.9 MM HEIGHT, 0.4 MM PITCH, QFN-68

AGLN030V5-ZQN68 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Actel
package instruction	8 X 8 MM, 0.9 MM HEIGHT, 0.4 MM PITCH, QFN-68
Reach Compliance Code	compli
maximum clock frequency	250 MHz
JESD-30 code	S-XQCC-N68
length	8 mm
Configurable number of logic blocks	768
Equivalent number of gates	30000
Number of entries	49
Number of logical units	768
Output times	49
Number of terminals	68
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
organize	768 CLBS, 30000 GATES
Package body material	UNSPECIFIED
encapsulated code	VQCCN
Encapsulate equivalent code	LCC68,.32SQ,16
Package shape	SQUARE
Package form	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.5 V
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage	1.575 V
Minimum supply voltage	1.425 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	NO LEAD
Terminal pitch	0.4 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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Revision 10

IGLOO nano Low Power Flash FPGAs

with Flash*Freeze Technology

Features and Benefits

Low Power

nanoPower Consumption—Industry’s Lowest Power

1.2 V to 1.5 V Core Voltage Support for Low Power

Supports Single-Voltage System Operation

Low Power Active FPGA Operation

Flash*Freeze Technology Enables Ultra-Low Power

Consumption while Maintaining FPGA Content

• Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode

•

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

Advanced I/Os

• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS

3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V

• Wide Range Power Supply Voltage Support per JESD8-B,

Allowing I/Os to Operate from 2.7 V to 3.6 V

• Wide Range Power Supply Voltage Support per JESD8-12,

Allowing I/Os to Operate from 1.14 V to 1.575 V

• I/O Registers on Input, Output, and Enable Paths

• Selectable Schmitt Trigger Inputs

• Hot-Swappable and Cold-Sparing I/Os

• Programmable Output Slew Rate and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the IGLOO

Family

†

• Up to Six CCC Blocks, One with an Integrated PLL

• Configurable Phase Shift, Multiply/Divide, Delay

Capabilities, and External Feedback

• Wide Input Frequency Range (1.5 MHz up to 250 MHz)

Small Footprint Packages

• As Small as 3x3 mm in Size

Wide Range of Features

• 10,000 to 250,000 System Gates

• Up to 36 kbits of True Dual-Port SRAM

• Up to 71 User I/Os

Reprogrammable Flash Technology

•

130-nm, 7-Layer Metal, Flash-Based CMOS Process

Live-at-Power-Up (LAPU) Level 0 Support

Single-Chip Solution

Retains Programmed Design When Powered Off

250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System

Performance

Clock Conditioning Circuit (CCC) and PLL

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock

to Secure FPGA Contents

• 1.2 V Programming

Embedded Memory

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM

Blocks (×1, ×2, ×4, ×9, and ×18 organizations)

†

• True Dual-Port SRAM (except × 18 organization)

†

Enhanced Commercial Temperature Range

• –20°C to +70°C

Table 1 •

IGLOO nano Devices

IGLOO nano-Z Devices

System Gates

Typical Equivalent Macrocells

VersaTiles (D-flip-flops)

Flash*Freeze Mode (typical, µW)

RAM kbits (1,024 bits)

4,608-Bit Blocks

FlashROM Bits

Secure (AES)

ISP

2,3

AGLN010 AGLN015 AGLN020

AGLN030Z

10K

260

–

UC36

QN48

15K

128

384

–

20K

172

520

–

UC81,

CS81

QN68

30K

256

768

–

UC81, CS81

QN48, QN68

VQ100

AGLN060

60K

512

1,536

Yes

CS81

VQ100

AGLN125

125K

1,024

3,072

Yes

CS81

VQ100

AGLN250

250K

2,048

6,144

Yes

CS81

VQ100

AGLN060Z AGLN125Z AGLN250Z

Integrated PLL in CCCs

VersaNet Globals

I/O Banks

Maximum User I/Os (packaged device)

Maximum User I/Os (Known Good Die)

Package Pins

UC/CS

QFN

VQFP

QN68

Notes:

AGLN030 is available in the Z feature grade only.

AGLN030 and smaller devices do not support this feature.

AGLN060, AGLN125, and AGLN250 in the CS81 package do not support PLLs.

For higher densities and support of additional features, refer to the

IGLOO

and

IGLOOe

handbooks.

† AGLN030 and smaller devices do not support this feature.

April 2010

IGLOO nano Low Power Flash FPGAs

Table of Contents

IGLOO nano Device Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

IGLOO nano DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-57

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-63

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-70

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-73

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-86

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-87

Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-88

Package Pin Assignments

36-Pin UC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

81-Pin UC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

81-Pin CS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6

48-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15

68-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18

100-Pin VQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6

Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6

R ev i si o n 1 0

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