KINGSTON.COM
Kingston DDR3/3L DRAM
for embedded applications
Kingston DDR3/3L
Kingston on-board DRAM is designed to meet the needs of embedded applications
and offers a low-voltage option for lower power consumption.
DDR3/3L Part Numbers and Specifications
DDR3/3L Part
Number
D2516EC4BXGGB
D5128EETBPGGBU
Capacity
4Gb
4Gb
Description
96 ball FBGA
DDR3/3L
78 ball FBGA
DDR3/3L
Package
Size
9.0x13.5x1.2
9.0x10.6x1.2
Organization
(words x bits)
256MX16
512Mx8
Speed
Mbps
1600
1600
VDD,
VDDQ
1.35V*
1.35V*
Operating
Temperature
0°C ~ +95°C
0°C ~ +95°C
*Backward compatible to 1.5V VDD, VDDQ
Features
• Double-data-rate architecture: two data transfers per clock cycle
• The high-speed data transfer is realized by the 8 bits prefetch pipelined
architecture
• Bi-directional differential data strobe (DOS and /DQS) is transmitted/received
with data for capturing data at the receiver
• DOS is edge-aligned with data for READS; center-aligned with data for WRITES
• Differential clock inputs (CK and !CK)
• DLL aligns DQ and DOS transitions with CK transitions
• Commands entered on each positive CK edge; data and data mask referenced
to both edges of DQS
• Data mask (DM) for write data
• Posted /CAS by programmable additive latency for better command and data
bus efficiency
• On-Die Termination (ODD for better signal quality
— Synchronous ODT
— Dynamic CDT
Asynchronous ODT
• Multi Purpose Register (MPR) for pre-defined pattern read out
• ZQ calibration for DO drive and ODT
• Programmable Partial Array Self-Refresh (PASR)
• /RESET pin for Power-up sequence and reset function
• SRT range: Normal/extended
• Programmable Output driver impedance control
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