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NPN - General Purpose Transistor Die
0.8 Amp, 40 Volt
CP225-2N2218A
The CP225-2N2218A is a silicon NPN transistor designed for small signal, general purpose and
switching applications.
MECHANICAL SPECIFICATIONS:
Die Size
19.7 x 19.7 MILS
10 MILS
4.3 x 4.3 MILS
4.3 x 4.3 MILS
Al – 30,000Å
Au – 12,000Å
2.6 MILS
4 INCHES
26,000
UNITS
V
V
V
mA
°C
UNITS
nA
nA
nA
V
V
V
V
V
V
V
B
Die Thickness
Base Bonding Pad Size
Emitter Bonding Pad Size
Top Side Metalization
E
Back Side Metalization
Scribe Alley Width
Wafer Diameter
Gross Die Per Wafer
SYMBOL
VCBO
VCEO
VEBO
IC
TJ, Tstg
MIN
BACKSIDE COLLECTOR
R2
MAXIMUM RATINGS:
(TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Operating and Storage Junction Temperature
ELECTRICAL
SYMBOL
ICBO
ICEV
IEBO
BVCBO
BVCEO
BVEBO
VCE(SAT)
VCE(SAT)
VBE(SAT)
VBE(SAT)
hFE
hFE
hFE
hFE
hFE
hFE
fT
Cob
ton
toff
CHARACTERISTICS:
(TA=25°C)
TEST CONDITIONS
VCB=60V
VCE=60V, VEB=3.0V
VEB=3.0V
IC=10μA
IC=10mA
IE=10μA
IC=150mA, IB=15mA
IC=500mA, IB=50mA
IC=150mA, IB=15mA
IC=500mA, IB=50mA
VCE=10V,
VCE=10V,
VCE=10V,
VCE=10V,
IC=100μA
IC=1.0mA
IC=10mA
IC=150mA
75
40
6.0
800
-65 to +150
MAX
10
10
10
75
40
6.0
0.3
1.0
1.2
2.0
20
25
35
40
20
25
250
8.0
35
285
120
VCE=1.0V, IC=150mA
VCE=10V, IC=500mA
VCE=20V, IC=20mA
VCB=10V, f=100kHz
VCC=30V, IC=150mA, IB=15mA
VCC=30V, IC=150mA, IB1=IB2=15mA
MHz
pF
ns
ns
R0 (22-February 2017)
CP225-2N2218A
Typical Electrical Characteristics
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R0 (22-February 2017)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT:
Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM:
Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN:
Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR:
Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
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OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2
nd
day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1.
2.
If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s
LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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