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5962-0052102VFA

Description
Buffer/Inverter Based MOSFET Driver,
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size386KB,6 Pages
ManufacturerDefense Logistics Agency
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5962-0052102VFA Overview

Buffer/Inverter Based MOSFET Driver,

5962-0052102VFA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerDefense Logistics Agency
package instruction,
Reach Compliance Codeunknow
Interface integrated circuit typeBUFFER OR INVERTER BASED MOSFET DRIVER
Peak Reflow Temperature (Celsius)NOT APPLICABLE
Certification statusQualified
Maximum time at peak reflow temperatureNOT APPLICABLE
www.ti.com
Table of Contents
Application Report
Hermetic Package Reflow Profiles, Termination
Finishes, and Lead Trim and Form
ABSTRACT
Hermetic microcircuits are still widely used in mission-critical aerospace, defense, and industrial applications.
Customers occasionally have questions regarding board-level assembly of these packages. A general set of
guidelines are addressed in this application note.
Table of Contents
1 Reflow Profiles........................................................................................................................................................................2
2 Critical Considerations for Gold-Plated Termination-Finishes..........................................................................................
3
3 Considerations for Leadless Ceramic Chip Carrier Packages...........................................................................................3
4 Lead Forming..........................................................................................................................................................................
4
5 Ceramic Packaging.................................................................................................................................................................4
6 References..............................................................................................................................................................................
5
List of Figures
Figure 1-1. Starting Profile for Typical Pb/Sn Solder Paste.........................................................................................................
2
List of Tables
Table 2-1. MIL-PRF-38535 TABLE A-III Composition and Coating Thickness Requirements.....................................................3
Trademarks
All other trademarks are the property of their respective owners.
SLVAEU0 – SEPTEMBER 2020
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Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and
Form
Copyright © 2020 Texas Instruments Incorporated
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