5962R0722962VZA datasheet, PDF

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5962R0722962VZA: DescriptionAdjustable Positive Standard Regulator, 1.2V Min, 57V Max, BIPolar, CDSO16, CERAMIC, SOIC-16; CategoryPower/power management The power supply circuit; File Size386KB，6 Pages; ManufacturerDefense Logistics Agency

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5962R0722962VZA Overview

Adjustable Positive Standard Regulator, 1.2V Min, 57V Max, BIPolar, CDSO16, CERAMIC, SOIC-16

5962R0722962VZA Parametric

Parameter Name	Attribute value
Maker	Defense Logistics Agency
Parts packaging code	SOIC
package instruction	SOP,
Contacts	16
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum Differential Input-Output Voltage	40 V
Minimum Differential Input-Output Voltage	3 V
JESD-30 code	R-CDSO-G16
Number of functions	1
Number of terminals	16
Working temperatureTJ-Max	150 °C
Maximum output voltage 1	57 V
Minimum output voltage 1	1.2 V
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Qualified
Regulator type	ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Filter level	MIL-PRF-38535 Class V
Maximum seat height	2.33 mm
surface mount	YES
technology	BIPOLAR
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
total dose	100k Rad(Si) V
width	6.35 mm

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Table of Contents

Application Report

Hermetic Package Reflow Profiles, Termination

Finishes, and Lead Trim and Form

ABSTRACT

Hermetic microcircuits are still widely used in mission-critical aerospace, defense, and industrial applications.

Customers occasionally have questions regarding board-level assembly of these packages. A general set of

guidelines are addressed in this application note.

Table of Contents

1 Reflow Profiles........................................................................................................................................................................2

2 Critical Considerations for Gold-Plated Termination-Finishes..........................................................................................

3 Considerations for Leadless Ceramic Chip Carrier Packages...........................................................................................3

4 Lead Forming..........................................................................................................................................................................

5 Ceramic Packaging.................................................................................................................................................................4

6 References..............................................................................................................................................................................

List of Figures

Figure 1-1. Starting Profile for Typical Pb/Sn Solder Paste.........................................................................................................

List of Tables

Table 2-1. MIL-PRF-38535 TABLE A-III Composition and Coating Thickness Requirements.....................................................3

Trademarks

All other trademarks are the property of their respective owners.

SLVAEU0 – SEPTEMBER 2020

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Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and

Form

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