D Latch, 2-Func, 4-Bit, TTL, CDIP24,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | compli |
| JESD-30 code | R-XDIP-T24 |
| Logic integrated circuit type | D LATCH |
| Humidity sensitivity level | 2A |
| Number of digits | 4 |
| Number of functions | 2 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| 5962-00-096-4043 | SF12R2701CTLA | 93L08DCQR | 93L08DCQM | 93L08DMQB | 93L08FCQM | 93L08FCQR | 93L08PCQM | |
|---|---|---|---|---|---|---|---|---|
| Description | D Latch, 2-Func, 4-Bit, TTL, CDIP24, | Fixed Resistor, Thin Film, 0.25W, 2700ohm, 200V, 0.25% +/-Tol, 25ppm/Cel, Surface Mount, 1206, CHIP | D Latch, 2-Func, 4-Bit, TTL, CDIP24, | D Latch, 2-Func, 4-Bit, TTL, CDIP24, | D Latch, 2-Func, 4-Bit, TTL, CDIP24, | D Latch, 2-Func, 4-Bit, TTL, CDFP24, | D Latch, 2-Func, 4-Bit, TTL, CDFP24, | D Latch, 2-Func, 4-Bit, TTL, PDIP24, |
| package instruction | DIP, DIP24,.6 | CHIP | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DFP, FL24,.4 | DFP, FL24,.4 | DIP, DIP24,.6 |
| Reach Compliance Code | compli | compliant | compliant | compliant | unknown | compliant | compliant | compliant |
| Number of terminals | 24 | 2 | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 155 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Package form | IN-LINE | SMT | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| surface mount | NO | YES | NO | NO | NO | YES | YES | NO |
| technology | TTL | THIN FILM | TTL | TTL | TTL | TTL | TTL | TTL |
| Is it lead-free? | Contains lead | - | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | - | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| JESD-30 code | R-XDIP-T24 | - | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDFP-F24 | R-XDFP-F24 | R-PDIP-T24 |
| Logic integrated circuit type | D LATCH | - | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| Humidity sensitivity level | 2A | - | 2A | 2A | - | 2A | 2A | 2A |
| Number of digits | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 2 | - | 2 | 2 | 2 | 2 | 2 | 2 |
| Package body material | CERAMIC | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | - | DIP | DIP | DIP | DFP | DFP | DIP |
| Encapsulate equivalent code | DIP24,.6 | - | DIP24,.6 | DIP24,.6 | DIP24,.6 | FL24,.4 | FL24,.4 | DIP24,.6 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Peak Reflow Temperature (Celsius) | 250 | - | 250 | 250 | - | 250 | 250 | 250 |
| power supply | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Temperature level | MILITARY | - | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | - | 30 | 30 | - | 30 | 30 | 30 |
| JESD-609 code | - | - | e0 | e0 | e0 | e0 | e0 | e0 |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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