UVPROM, 8KX8, 200ns, MOS, CDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Intel |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknow |
| Maximum access time | 200 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| memory density | 65536 bi |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Programming voltage | 12.5 V |
| Maximum slew rate | 0.075 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
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