L7C187DC8 datasheet, PDF - EEWORLD Datasheet

L7C187DC8: DescriptionStandard SRAM, 64KX1, 8ns, CMOS, CDIP22, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-22; Categorystorage storage; File Size243KB，6 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L7C187DC8 Overview

Standard SRAM, 64KX1, 8ns, CMOS, CDIP22, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-22

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	DIP, DIP22,.3
Contacts	22
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	8 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	SEPARATE
JESD-30 code	R-CDIP-T22
JESD-609 code	e0
length	27.94 mm
memory density	65536 bi
Memory IC Type	STANDARD SRAM
memory width	1
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	22
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX1
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP22,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.953 mm
Maximum standby current	0.00025 A
Minimum standby current	2 V
Maximum slew rate	0.16 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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