OTP ROM, 512X8, 30ns, TTL, CDIP22
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DIP, DIP22,.4 |
| Reach Compliance Code | unknow |
| Maximum access time | 30 ns |
| JESD-30 code | R-XDIP-T22 |
| JESD-609 code | e0 |
| memory density | 4096 bi |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 22 |
| word count | 512 words |
| character code | 512 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512X8 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| AM27S27DM | AM27S27DC | |
|---|---|---|
| Description | OTP ROM, 512X8, 30ns, TTL, CDIP22 | OTP ROM, 512X8, 27ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | AMD | AMD |
| package instruction | DIP, DIP22,.4 | DIP, DIP22,.4 |
| Reach Compliance Code | unknow | unknow |
| Maximum access time | 30 ns | 27 ns |
| JESD-30 code | R-XDIP-T22 | R-GDIP-T22 |
| JESD-609 code | e0 | e0 |
| memory density | 4096 bi | 4096 bi |
| Memory IC Type | OTP ROM | OTP ROM |
| memory width | 8 | 8 |
| Number of terminals | 22 | 22 |
| word count | 512 words | 512 words |
| character code | 512 | 512 |
| Maximum operating temperature | 125 °C | 75 °C |
| organize | 512X8 | 512X8 |
| Package body material | CERAMIC | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP22,.4 | DIP22,.4 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | NO |
| technology | TTL | BIPOLAR |
| Temperature level | MILITARY | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
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