AT91SAM9N12-CFU datasheet, PDF

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AT91SAM9N12-CFU: DescriptionMicroprocessor, 400MHz, CMOS, PBGA247; CategoryThe embedded processor and controller Microcontrollers and processors; File Size5MB，1158 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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AT91SAM9N12-CFU Overview

Microprocessor, 400MHz, CMOS, PBGA247

AT91SAM9N12-CFU Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
package instruction	BGA-247
Reach Compliance Code	compli
ECCN code	3A001.A.2
Address bus width	26
bit size	32
boundary scan	YES
maximum clock frequency	50 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B247
JESD-609 code	e1
length	10 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	247
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA247,19X19,20
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1,1.8/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.37 mm
speed	400 MHz
Maximum supply voltage	1.1 V
Minimum supply voltage	0.9 V
Nominal supply voltage	1 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

User Manual

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SAM9N12/SAM9CN11/SAM9CN12

Atmel | SMART ARM-based Embedded MPU

DATASHEET

Description

The Atmel

| SMART SAM9N and SAM9CN ARM926EJ-S™-based embedded

MPUs offer the frequently-requested combination of user interface functionality

and high data rate connectivity, with LCD controller, resistive touchscreen,

multiple UARTs, SPI, I2C, full-speed USB Host and Device and SDIO.

These eMPUs support the latest generation of LPDDR/DDR2 and NAND Flash

memory interfaces for program and data storage. An internal 133 MHz multi-layer

bus architecture associated with eight DMA channels and distributed memory—

including a 32-Kbyte SRAM—sustains the high bandwidth required by the

processor and the high-speed peripherals.

The SAM9CN devices offer on-chip hardware accelerators with DMA support that

enable high-speed data encryption and authentication of transferred data or

applications. Supported standards are up to 256-bit AES, and FIPS Publication

180-2 compliant SHA1 and SHA256. A True Random Number Generator is

embedded for key generation and exchange protocols. The devices also feature

fuse bits for crypto key (SAM9CN12), user configuration (SAM9N12 and

SAM9CN11) and device configuration (all). The SAM9CN12 includes a secure

Boot ROM; the SAM9N12 and SAM9CN11 include a standard Boot ROM.

The I/Os support 1.8V or 3.3V operation and are independently configurable for

the memory interface and peripheral I/Os. This feature eliminates the need for any

external level shifters, while 0.8mm ball pitch packages lower PCB cost and

complexity.

The SAM9N and SAM9CN power management controllers feature efficient clock

gating and a battery backup section that minimizes power consumption in active

and standby modes. The following table presents the embedded features of each

device.

Device Configuration

Feature

Standard Boot with BSC

Secure Boot

TRNG

AES

SHA

SAM9N12



–



–

SAM9CN11



–



SAM9CN12

–



Atmel-11063L-ATARM-SAM9N12-SAM9CN11-SAM9CN12-Datasheet_28-Oct-15

AT91SAM9N12-CFU Related Products

	AT91SAM9N12-CFU
Description	Microprocessor, 400MHz, CMOS, PBGA247
Is it Rohs certified?	conform to
Maker	Microchip
package instruction	BGA-247
Reach Compliance Code	compli
ECCN code	3A001.A.2
Address bus width	26
bit size	32
boundary scan	YES
maximum clock frequency	50 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B247
JESD-609 code	e1
length	10 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	247
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA247,19X19,20
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1,1.8/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.37 mm
speed	400 MHz
Maximum supply voltage	1.1 V
Minimum supply voltage	0.9 V
Nominal supply voltage	1 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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