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CDLL5918D

Description
Zener Diode, 5.1V V(Z), 1%, 1.25W, Silicon, Unidirectional, DO-213AB
CategoryDiscrete semiconductor    diode   
File Size293KB,5 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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Zener Diode, 5.1V V(Z), 1%, 1.25W, Silicon, Unidirectional, DO-213AB

CDLL5918D Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrochip
package instructionMELF-2
Reach Compliance Codecompli
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
Available
Metallurgically Bonded Glass Surface Mount
1.5 Watt Zener Diodes
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar
in electrical features to the JEDEC registered 1N5913B through 1N5956B axial-leaded
package for 3.3 to 200 V. It is an ideal selection for applications of high density and low
parasitic requirements. Due to its glass hermetic qualities and metallurgically enhanced
internal contacts, it may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in
Features below.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-213AB MELF
Package
Also available in:
DO-41 package
(glass axial-leaded)
1N5913BG – 1N5956BG
FEATURES
Surface mount equivalent of JEDEC registered 1N5913B TO 1N5956B number series.
Zener voltage available 3.3 V to 200 V.
Voltage tolerances of 10%, 5%, 2% and 1% are available.
Screening in reference to MIL-PRF-19500 is available.
(See
part nomenclature
for all available options.)
RoHS compliant versions are available.
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
SMAJ package
APPLICATIONS / BENEFITS
Regulates voltage over a broad ranges of operation current and temperature.
Leadless package ideal for high-density surface mounting.
Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance.
Hermetically sealed glass package.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Specified capacitance (see
figure 2).
Inherently radiation hard as described in Microsemi
MicroNote 050.
o
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
MAXIMUM RATINGS
@ T
A
= 25 C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-End Cap
(1)
Thermal Resistance Junction-to-Ambient
Steady State Power Dissipation
@ T
EC
≤ 115 ºC
(1)
@ T
A
= 25 ºC
Rated Average Power Dissipation (also see
figure 1)
Forward Voltage
@ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
& T
STG
R
ӨJEC
R
ӨJA
P
D
P
M(AV)
V
F
T
SP
Value
-65 to +175
40
120
1.5
1.25
1.5
1.2
260
Unit
o
C
o
C/W
o
C/W
W
W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 1 of 5

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