MT18KDF1G72PDZ-1G4XX datasheet, PDF

Datasheet> All Categories > storage> storage> MT18KDF1G72PDZ-1G4XX

MT18KDF1G72PDZ-1G4XX: DescriptionDDR DRAM Module, 1GX72, CMOS, HALOGEN FREE, MO-269R/CL, RDIMM-240; Categorystorage storage; File Size409KB，21 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

Download Datasheet Parametric Compare View All

MT18KDF1G72PDZ-1G4XX Overview

DDR DRAM Module, 1GX72, CMOS, HALOGEN FREE, MO-269R/CL, RDIMM-240

MT18KDF1G72PDZ-1G4XX Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	240
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240
JESD-609 code	e4
length	133.35 mm
memory density	77309411328 bi
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	1073741824 words
character code	1000000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1GX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Maximum seat height	18.9 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.45 V
Minimum supply voltage (Vsup)	1.283 V
Nominal supply voltage (Vsup)	1.35 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	GOLD
Terminal form	NO LEAD
Terminal pitch	1 mm
Terminal location	DUAL

Preview

Download Datasheet

View All

4GB, 8GB (x72, ECC, DR) 240-Pin 1.35V DDR3L VLP RDIMM

Features

1.35V DDR3L SDRAM VLP RDIMM

MT18KDF51272PDZ – 4GB

MT18KDF1G72PDZ – 8GB

Features

• DDR3L functionality and operations supported as

defined in the component data sheet

• 240-pin, registered dual in-line, very-low-profile

memory module (VLP RDIMM)

• Fast data transfer rates: PC3-12800, PC3-10600,

PC3-8500, or PC3-6400

• 4GB (512 Meg x 72), 8GB (1 Gig x 72)

• V

= 1.35V (1.283–1.45V)

• V

= 1.5V (1.425–1.575V)

• Backward-compatible to V

= 1.5V ±0.075V

• V

DDSPD

= 3.0–3.6V

• Supports ECC error detection and correction

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Dual-rank

• On-board I

C temperature sensor with integrated

serial presence-detect (SPD) EEPROM

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Gold edge contacts

• Halogen-free

• Fly-by topology

• Terminated control, command, and address bus

Table 1: Key Timing Parameters

Speed

Grade

-1G6

-1G4

-1G1

-1G0

-80B

Industry

Nomenclature

PC3-12800

PC3-10600

PC3-8500

PC3-6400

Data Rate (MT/s)

CL = 11 CL = 10

1600

–

1333

–

CL = 9

1333

–

CL = 8

1066

–

CL = 7

1066

–

CL = 6

800

CL = 5

667

RCD

Figure 1: 240-Pin RDIMM (MO-269 R/C L)

Module height: 18.75mm (0.738in)

Options

• Operating

– Commercial (0°C

≤

+70°C)

– Industrial (–40°C

≤

+85°C)

• Package

– 240-pin DIMM (halogen-free)

• Frequency/CAS latency

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.87ns @ CL = 7 (DDR3-1066)

Note:

temperature

Marking

None

-1G6

-1G4

-1G1

1. Contact Micron for industrial temperature

module offerings.

(ns)

13.125

(ns)

13.125

(ns)

48.125

49.125

50.625

52.5

PDF: 09005aef847d79ed

kdf18c512_1Gx72pdz - Rev. E 10/12 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT18KDF1G72PDZ-1G4XX Related Products

	MT18KDF1G72PDZ-1G4XX	MT18KDF1G72PDZ-1G6XX	MT18KDF1G72PDZ-1G1XX
Description	DDR DRAM Module, 1GX72, CMOS, HALOGEN FREE, MO-269R/CL, RDIMM-240	DDR DRAM Module, 1GX72, CMOS, HALOGEN FREE, MO-269R/CL, RDIMM-240	DDR DRAM Module, 1GX72, CMOS, HALOGEN FREE, MO-269R/CL, RDIMM-240
Maker	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	DIMM	DIMM	DIMM
package instruction	DIMM,	DIMM,	DIMM,
Contacts	240	240	240
Reach Compliance Code	unknow	compli	compli
ECCN code	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240
JESD-609 code	e4	e4	e4
length	133.35 mm	133.35 mm	133.35 mm
memory density	77309411328 bi	77309411328 bi	77309411328 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	72	72	72
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	240	240	240
word count	1073741824 words	1073741824 words	1073741824 words
character code	1000000000	1000000000	1000000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	1GX72	1GX72	1GX72
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Maximum seat height	18.9 mm	18.9 mm	18.9 mm
self refresh	YES	YES	YES
Maximum supply voltage (Vsup)	1.45 V	1.45 V	1.45 V
Minimum supply voltage (Vsup)	1.283 V	1.283 V	1.283 V
Nominal supply voltage (Vsup)	1.35 V	1.35 V	1.35 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	GOLD	GOLD	GOLD
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1 mm	1 mm	1 mm
Terminal location	DUAL	DUAL	DUAL

Recommended Resources

Diamond Differential BTL Power Amplifier Circuit-Power Amplifier

Bit brand fully automatic soybean milk machine circuit diagram

Protected current expansion circuit diagram

High common mode voltage differential amplifier circuit

Charging and discharging system composed of MAXl660

810E computer motherboard circuit diagram_18

PCB circuit board heat dissipation tips: [p=null, 2, left][color=rgb(71, 71, 71)][font=宋体, Arial][size=14px] The heat generated by electronic equipment during operation causes the internal temperature of the equipment to rise rapidly. If the...; ohahaha PCB Design

【LPC810】flash magic software serial port download code + LED flashing: The 8-pin Cotrex M0+ is very delicately designed! Show the board + USB to serial download cable...; 大秦正声 NXP MCU

The network part in the Cadence re-import netlist rule is lost: [i=s] This post was last edited by Yuting Wanqing on 2018-6-4 14:44 [/i] The network part in the netlist rule re-imported into cadence is lost...; 雨亭婉清 PCB Design

Exposed! Another unfinished semiconductor project: defrauding state-owned land and refusing to return it! Using the name of chips to engage in real estate?: While various regions are vigorously developing the integrated circuit industry, "unfinished" projects have been exposed repeatedly. Recently, the unfinished project of Hebei Angyang Microelectronics ...; eric_wang Talking

Analysis of the current status of communication power supply.pdf: Analysis of the current status of communication power supply.pdf...; qiang115724 PCB Design

I would like to ask you some questions about eboot and binfs!!!: I have studied eboot burning and loading images and binfs in the past two days. The research is not in-depth enough. I have read the blogs written by my predecessors, but I still have many questions. ...; jiafa Embedded System

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components