1Gb: x8, x16 Automotive DDR2 SDRAM
Features
Automotive DDR2 SDRAM
MT47H128M8 – 16 Meg x 8 x 8 banks
MT47H64M16 – 8 Meg x 16 x 8 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
V
DD
= 1.8V ±0.1V, V
DDQ
= 1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
8 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths (BL): 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
RoHS-compliant
Supports JEDEC clock jitter specification
AEC-Q100
PPAP submission
8D response time
Options
1
• Configuration
– 128 Meg x 8 (16 Meg x 8 x 8 banks)
– 64 Meg x 16 (8 Meg x 16 x 8 banks)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm) Die
Rev :M
• FBGA package (Pb-free) – x8
– 60-ball FBGA (8mm x 10mm) Die
Rev :M
• Timing – cycle time
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
• Special option
– Standard
– Automotive grade
• Operating temperature
– Industrial (–40°C
≤
T
C
≤
+95°C)
– Automotive (–40°C
≤
T
C
≤
+105°C)
• Revision
Note:
Marking
128M8
64M16
NF
SH
-25E
-25
-3
None
A
IT
AT
:M
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-25E
-25E
-3
CL = 3
400
400
400
CL = 4
533
533
533
CL = 5
800
667
667
CL = 6
800
800
n/a
CL = 7
n/a
n/a
n/a
t
RC
(ns)
55
55
55
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
128 Meg x 8
16 Meg x 8 x 8 banks
8K
A[13:0] (16K)
64 Meg x 16
8 Meg x 16 x 8 banks
8K
A[12:0] (8K)
PDF: 09005aef85a711f4
1gb_ddr2_ait-aat_u88b.pdf – Rev. A 05/14 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
1Gb: x8, x16 Automotive DDR2 SDRAM
Features
Table 2: Addressing (Continued)
Parameter
Bank address
Column address
128 Meg x 8
BA[2:0] (8)
A[9:0] (1K)
64 Meg x 16
BA[2:0] (8)
A[9:0] (1K)
Figure 1: 1Gb DDR2 Part Numbers
MT
Micron Technology
Product Family
47 = DDR2 SDRAM
47
H
32M16
NF
-25E
IT
:H
Design Revision
:H/:M revision
Operating Temperature
IT = Industrial temperature
AT = Automotive temperature
Special Options
Blank = No special options
A = Automotive grade
Operating Voltage
H = 1.8V V
DD
CMOS
Configuration
128M8 = 128 Meg x 8
64M16 = 64 Meg x 16
Cycle Time
-3 =
t
CK = 3.0ns, CL = 5
-25 =
t
CK = 2.5ns, CL = 6
-25E =
t
CK = 2.5ns, CL = 5
Package Codes
HR = 84-ball FBGA, 8mm x 12.5mm
NF = 60-ball FBGA, 8mm x 10mm
SH = 60-ball FBGA, 8mm x 10mm
Note:
1. Not all speeds and configurations are available in all packages.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef85a711f4
1gb_ddr2_ait-aat_u88b.pdf – Rev. A 05/14 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
1Gb: x8, x16 Automotive DDR2 SDRAM
Features
Contents
State Diagram .................................................................................................................................................. 8
Functional Description ..................................................................................................................................... 9
Automotive Industrial Temperature ............................................................................................................... 9
Automotive Temperature ............................................................................................................................ 10
General Notes ............................................................................................................................................ 10
Functional Block Diagrams ............................................................................................................................. 11
Ball Assignments and Descriptions ................................................................................................................. 13
Packaging ...................................................................................................................................................... 17
Package Dimensions ................................................................................................................................... 17
FBGA Package Capacitance ......................................................................................................................... 19
Electrical Specifications – Absolute Ratings ..................................................................................................... 20
Temperature and Thermal Impedance ........................................................................................................ 20
Electrical Specifications – I
DD
Parameters ........................................................................................................ 22
I
DD
Specifications and Conditions ............................................................................................................... 22
I
DD7
Conditions .......................................................................................................................................... 22
AC Timing Operating Specifications .............................................................................................................. 0
AC and DC Operating Conditions .................................................................................................................... 33
ODT DC Electrical Characteristics ................................................................................................................... 33
Input Electrical Characteristics and Operating Conditions ............................................................................... 34
Output Electrical Characteristics and Operating Conditions ............................................................................. 37
Output Driver Characteristics ......................................................................................................................... 39
Power and Ground Clamp Characteristics ....................................................................................................... 43
AC Overshoot/Undershoot Specification ......................................................................................................... 44
Input Slew Rate Derating ................................................................................................................................ 46
Commands .................................................................................................................................................... 60
Truth Tables ............................................................................................................................................... 60
DESELECT ................................................................................................................................................. 64
NO OPERATION (NOP) ............................................................................................................................... 65
LOAD MODE (LM) ...................................................................................................................................... 65
ACTIVATE .................................................................................................................................................. 65
READ ......................................................................................................................................................... 65
WRITE ....................................................................................................................................................... 65
PRECHARGE .............................................................................................................................................. 66
REFRESH ................................................................................................................................................... 66
SELF REFRESH ........................................................................................................................................... 66
Mode Register (MR) ........................................................................................................................................ 67
Burst Length .............................................................................................................................................. 67
Burst Type .................................................................................................................................................. 69
Operating Mode ......................................................................................................................................... 69
DLL RESET ................................................................................................................................................. 69
Write Recovery ........................................................................................................................................... 69
Power-Down Mode ..................................................................................................................................... 70
CAS Latency (CL) ........................................................................................................................................ 70
Extended Mode Register (EMR) ....................................................................................................................... 72
DLL Enable/Disable ................................................................................................................................... 73
Output Drive Strength ................................................................................................................................ 73
DQS# Enable/Disable ................................................................................................................................. 73
RDQS Enable/Disable ................................................................................................................................. 73
Output Enable/Disable ............................................................................................................................... 73
On-Die Termination (ODT) ......................................................................................................................... 74
PDF: 09005aef85a711f4
1gb_ddr2_ait-aat_u88b.pdf – Rev. A 05/14 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
1Gb: x8, x16 Automotive DDR2 SDRAM
Features
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 74
Posted CAS Additive Latency (AL) ................................................................................................................ 74
Extended Mode Register 2 (EMR2) ................................................................................................................... 76
Extended Mode Register 3 (EMR3) ................................................................................................................... 77
Initialization .................................................................................................................................................. 78
ACTIVATE ...................................................................................................................................................... 81
READ ............................................................................................................................................................. 83
READ with Precharge .................................................................................................................................. 87
READ with Auto Precharge .......................................................................................................................... 89
WRITE ........................................................................................................................................................... 95
PRECHARGE ................................................................................................................................................. 106
REFRESH ...................................................................................................................................................... 107
SELF REFRESH .............................................................................................................................................. 108
Power-Down Mode ........................................................................................................................................ 110
Precharge Power-Down Clock Frequency Change ........................................................................................... 117
Reset ............................................................................................................................................................. 118
CKE Low Anytime ...................................................................................................................................... 118
ODT Timing .................................................................................................................................................. 120
MRS Command to ODT Update Delay ........................................................................................................ 122
PDF: 09005aef85a711f4
1gb_ddr2_ait-aat_u88b.pdf – Rev. A 05/14 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
1Gb: x8, x16 Automotive DDR2 SDRAM
Features
List of Figures
Figure 1: 1Gb DDR2 Part Numbers ................................................................................................................... 2
Figure 2: Simplified State Diagram ................................................................................................................... 8
Figure 3: 128 Meg x 8 Functional Block Diagram ............................................................................................. 11
Figure 4: 64 Meg x 16 Functional Block Diagram ............................................................................................. 12
Figure 5: 60-Ball FBGA – x8 Ball Assignments (Top View) ................................................................................ 13
Figure 6: 84-Ball FBGA – x16 Ball Assignments (Top View) ............................................................................... 14
Figure 7: 84-Ball FBGA Package (8mm x 12.5mm) – x16; "NF" Die Rev :M ......................................................... 17
Figure 8: 60-Ball FBGA (8mm x 10mm) – x8; "SH" Die Rev :M .......................................................................... 18
Figure 9: Example Temperature Test Point Location ........................................................................................ 21
Figure 10: Single-Ended Input Signal Levels ................................................................................................... 34
Figure 11: Differential Input Signal Levels ...................................................................................................... 35
Figure 12: Differential Output Signal Levels .................................................................................................... 37
Figure 13: Output Slew Rate Load .................................................................................................................. 38
Figure 14: Full Strength Pull-Down Characteristics ......................................................................................... 39
Figure 15: Full Strength Pull-Up Characteristics .............................................................................................. 40
Figure 16: Reduced Strength Pull-Down Characteristics .................................................................................. 41
Figure 17: Reduced Strength Pull-Up Characteristics ...................................................................................... 42
Figure 18: Input Clamp Characteristics .......................................................................................................... 43
Figure 19: Overshoot ..................................................................................................................................... 44
Figure 20: Undershoot ................................................................................................................................... 44
Figure 21: Nominal Slew Rate for
t
IS ............................................................................................................... 49
Figure 22: Tangent Line for
t
IS ........................................................................................................................ 49
Figure 23: Nominal Slew Rate for
t
IH .............................................................................................................. 50
Figure 24: Tangent Line for
t
IH ....................................................................................................................... 50
Figure 25: Nominal Slew Rate for
t
DS ............................................................................................................. 56
Figure 26: Tangent Line for
t
DS ...................................................................................................................... 56
Figure 27: Nominal Slew Rate for
t
DH ............................................................................................................. 57
Figure 28: Tangent Line for
t
DH ..................................................................................................................... 57
Figure 29: AC Input Test Signal Waveform Command/Address Balls ................................................................ 58
Figure 30: AC Input Test Signal Waveform for Data with DQS, DQS# (Differential) ............................................ 58
Figure 31: AC Input Test Signal Waveform for Data with DQS (Single-Ended) ................................................... 59
Figure 32: AC Input Test Signal Waveform (Differential) .................................................................................. 59
Figure 33: MR Definition ............................................................................................................................... 68
Figure 34: CL ................................................................................................................................................. 71
Figure 35: EMR Definition ............................................................................................................................. 72
Figure 36: READ Latency ............................................................................................................................... 75
Figure 37: WRITE Latency .............................................................................................................................. 75
Figure 38: EMR2 Definition ........................................................................................................................... 76
Figure 39: EMR3 Definition ........................................................................................................................... 77
Figure 40: DDR2 Power-Up and Initialization ................................................................................................. 78
Figure 41: Example: Meeting
t
RRD (MIN) and
t
RCD (MIN) .............................................................................. 81
Figure 42: Multibank Activate Restriction ....................................................................................................... 82
Figure 43: READ Latency ............................................................................................................................... 84
Figure 44: Consecutive READ Bursts .............................................................................................................. 85
Figure 45: Nonconsecutive READ Bursts ........................................................................................................ 86
Figure 46: READ Interrupted by READ ............................................................................................................ 87
Figure 47: READ-to-WRITE ............................................................................................................................ 87
Figure 48: READ-to-PRECHARGE – BL = 4 ...................................................................................................... 88
Figure 49: READ-to-PRECHARGE – BL = 8 ...................................................................................................... 88
Figure 50: Bank Read – Without Auto Precharge .............................................................................................. 90
PDF: 09005aef85a711f4
1gb_ddr2_ait-aat_u88b.pdf – Rev. A 05/14 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
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