EEWORLDEEWORLDEEWORLD

Part Number

Search

822MM25S

Description
Engineering Bulletin
File Size55KB,2 Pages
ManufacturerNPC
Websitehttp://www.npc.co.jp/en/
Download Datasheet View All

822MM25S Overview

Engineering Bulletin

Engineering Bulletin
of innovative electrolyte and new technologies
Very low impedance at high frequency
Endurance with ripple current: 4,000 to 7,000 hours at 105℃
Solvent resistant type
RoHS Compliant
Adoption
No.804G / Mar.2012
Tentative
Miniature Aluminum Electrolytic Capacitors
Low impedance, 105℃
◆SPECIFICATIONS
Items
Category
Temperature Range
Rated Voltage Range
Capacitance Tolerance
Leakage Current
Dissipation Factor
(tan
δ)
Low Temperature
Characteristics
(Max. Impedance Ratio)
Endurance
-55
to +105℃
Characteristics
6.3 to 35V
dc
±20%
(M)
I=0.01CV or 3µA, whichever is greater.
Where, I : Max. leakage current (µA), C : Nominal capacitance (µF), V : Rated voltage (V)
Rated voltage (V
dc
)
6.3V 10V 16V 25V 35V
tanδ (Max.)
0.22 0.19 0.16 0.14 0.12
When nominal capacitance exceeds 1,000µF, add 0.02 to the value above for each 1,000µF increase.
6.3V 10V 16V 25V 35V
Rated voltage (V
dc
)
3
3
3
4
3
Z(-55
)/Z(+20
)
(at 20℃, 120Hz)
(at 20℃ after 2 minutes)
(at 20℃, 120Hz)
Shelf Life
(at 120Hz)
The following specifications shall be satisfied when the capacitors are restored to 20℃ after subjected to DC voltage with the rated
ripple current is applied (the peak voltage shall not exceed the rated voltage) for the specified period of time at 105℃.
Time
φ
10 : 4,000hours
  φ
12.5 : 5,000hours
  φ
16 to 18 : 7,000hours
16 to 35V
dc
6.3 to 10V
dc
(
φ
12.5 to18)
Rated voltage
6.3 to 10V
dc
(
φ
10)
±20%
of the initial value
±20%
of the initial value
Capacitance change
30% of the initial value
±
D.F.(tanδ)
≦300%
of the initial specified value
200% of the initial specified value
200% of the initial specified value
The initial specified value
The initial specified value
Leakage current
The initial specified value
The following specifications shall be satisfied when the capacitors are restored to 20℃ after exposing them for 1,000 hours at 105℃ without
voltage applied. Before the measurement, the capacitor shall be preconditioned by applying voltage according to Item 4.1 of JIS C 5101-4.
16 to 35V
dc
6.3 to 10V
dc
(
φ
12.5 to18)
Rated voltage
6.3 to 10V
dc
(
φ
10)
±20%
of the initial value
±20%
of the initial value
Capacitance change
±30%
of the initial value
D.F.(tanδ)
300% of the initial specified value
200% of the initial specified value
200% of the initial specified value
The initial specified value
The initial specified value
Leakage current
The initial specified value
DIMENSIONS [mm]
Terminal
Code : E
F
±
0.5
F
±
0.5
φd
φ
D
φ
d
Sleeve (PET : Dark blue)
F
φ
D'
10
0.6
5.0
L'
Vent
15min.
4min.
10)
(φ12.5 to
φ18)
L'
16
12.5
0.8
0.6
7.5
5.0
φD+0.5max.
L+1.5max.
18
0.8
7.5
φD'
Gas escape end seal
PART NUMBERING SYSTEM
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
E L ZA
AAA
E
AA AAA
M
AAA
S
Supplement code
Size code
Capacitance tolerance code
Capacitance code (ex. 680µF:681, 2,200µF:222)
Lead forming·taping code
Terminal code
Voltage code (ex. 6.3V:6R3, 25V:250)
Series code
Category
Specifications in this bulletin are subject to change without notice.
1
NIPPON CHEMI-CON CORPORATION
1556
Everyone, please say a few words, thank you.
What does the bank in the memory control mean when using s3c2410, 2413, 2440? And what is the connection between the bank and the chip select (cs) of the peripheral chip? I am just starting out, pleas...
liuzh Embedded System
wince upload files to the server
I saw some wince support on the Internet....
zxinqiao Embedded System
I want to ask a question about network communication
I have a project that needs to be debugged with the other party. The other party gave me an IP and port, and we communicated via UDP. The problem I have now is that I don't know how to send and receiv...
ena MCU
Looking for touch screen driver
I need to make a touch screen driver recently, and I have never been exposed to it before. If anyone has a program or source code for touch screen driver, please send it to me. I will be very grateful...
smjw9186 Embedded System
Detailed explanation of the technology of thermal transfer plate making method
Hardware required for thermal transfer board making : 1: A print output device for producing high-precision plastic toner solder mask, such as a laser printer or a copier (a copier needs a copy of the...
pcbanfang00 PCB Design
Nest founder: The threshold for smart hardware companies is not as low as imagined (repost)
[url]http://people.techweb.com.cn/2014-01-21/2000544.shtml[/url] Excerpt, please see the link for the full text [p=25, 2, left][color=rgb(0, 0, 0)][font=Simsun][b]Smart home is not an ideal paradise f...
wangfuchong Talking

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2510  2845  1277  428  1804  51  58  26  9  37 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号