TECHNICAL DATASHEET
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND
®
84-1LMISR4 electrically conductive die
attach adhesive has been formulated for use in high
throughput, automatic die attach equipment. The rhe-
ology of ABLEBOND 84-1LMISR4 adhesive allows
minimum adhesive dispense and die put down dwell
ABLEBOND
®
84-1LMISR4
times, without tailing or stringing problems. The unique
combination of adhesive properties makes this material
one the most widely used die attach materials in the
semiconductor industry.
FEATURES
• Excellent dispensability with minimal tailing and stringing
• Box oven cure
Test
Method
ATM-0018
ATM-0089
ATM-0067
ATM-0068
Test Description
10 x 10 mm Si die on glass slide
Test
Method
ATM-0031
Typical Uncured Properties
Filler Type
Viscosity @ 25ºC
Thixotropic Index
Work Life @ 25ºC
Storage Life @ -40ºC
Cure Process Data
Weight Loss on Cure
Recommended Cure Condition
Alternate Cure Condition
(1)
(1)
ABLEBOND 84-1LMISR4
Silver
8000 cP
5.6
18 hours
1 year
ABLEBOND 84-1LMISR4
5.3%
1 hour @ 175ºC
Test Description
Brookfield CP51 @ 5 rpm
Viscosity @ 0.5/Viscosity @ 5 rpm
Physical worklife by % filler
3 - 5ºC / min ramp to 175ºC + 1 hour @ 175ºC
The ramp was observed to yield reduced bondline voiding and increased strength
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary
based on customers’ experience and their application requirements, as well as customer curing equipment, oven
loading and actual oven temperatures.
PHYSIOCHEMICAL PROPERTIES
- Post Cure
Ionics
Chloride
Sodium
Potassium
ABLEBOND 84-1LMISR4
< 20 ppm
< 10 ppm
< 10 ppm
13 µmhos/cm
6
0.35%
Test Description
Teflon flask, 5 gm sample/20-40
mesh, 50 gm DI water, 100ºC for
24 hours
Conductometer
pH meter
Thermogravimetric analysis
Test
Method
ATM-0007
ATM-0044
ATM-0002
ATM-0073
Water Extract Conductivity
pH
Weight Loss @ 300ºC
The figures shown above are typical values only. If you need to write a specification, please request our current
Standard Release Specification.
07/05
Page 1 of 3
84-1LMISR4
APPLICATION GUIDELINES
SHIPMENT
This Ablestik product is packed and shipped in dry ice at –80ºC.
Inside every dry ice shipment of Ablestik’s products is a small
packet containing the ABLECUBE. This is a small blue cube
which retains its shape at –40ºC. If the ABLECUBE is exposed to
temperatures higher than –40ºC, the cube will melt. Please check
the state of the ABLECUBE to ensure the integrity of the shipment.
If the ABLECUBE has melted upon Receiving inspection, place
the entire shipment in a –40ºC freezer and contact your Ablestik
Customer Service or Sales Representative.
UNPACKING
Transfer the syringes from the dry ice to a –40ºC freezer without
ANY delays. Freeze-thaw voids will form in the syringes if the
syringes are repeatedly thawed and refrozen.
STORAGE
This Ablestik product must be stored at –40ºC. If stored at these
conditions, ABLEBOND 84-1LMISR4 adhesive may be usable for
up to one (1) year. Alternate storage conditions may be used as
follows:
ADHESIVE APPLICATION
Thawed adhesive should be immediately placed on dispense
equipment for use. If the adhesive is transferred to a final
dispensing reservoir, care must be exercised to avoid entrapment
of contaminants and/or air into the adhesive. Adhesive must be
completely used within the product’s recommended work life of
18 hours. Silver-resin separation may occur if the adhesive is left
out at ambient beyond the recommended work life.
Apply enough adhesive to achieve a 25-50
µm
(1-2 mil) wet
bondline thickness, dispensed with approximately 25% - 50%
filleting on all sides of the die. Alternate dispense amounts may
be used depending on the application requirements. Star or
crossed shaped dispense patterns will yield fewer bondline voids
than the matrix style of dispense pattern.
Contact your Ablestik Technical Service Department for detailed
recommendation on adhesive application, including dispensing.
CURE
This adhesive should be cured in conventional box oven per the
recommended cure condition. Refer to the Cure Process Data
section of the Technical Data Sheet for the recommended cure
cycles.
AVAILABILITY
ABLEBOND
®
adhesives are packaged in syringes or jars per
customer specification. Available package sizes range from 1cc
to 30cc and 1 ounce to 1 pound. For details, refer to the Ablestik
Standard Package Data Set or contact your Customer Service
Representative.
Storage Temp
0ºC to +5ºC
* Jar rolling required
Syringes
8 days
2 months
Jars
1 month*
6 months”
-15ºC to -10ºC
The shelf life of the material is only valid when the material has
been stored at the correct storage condition. Incorrect storage
conditions will degrade the performance of the material in both
handling (e.g. dispensing) and final cured properties.
THAWING
Allow the container to reach room temperature before use. After
removing from the freezer, set the syringes to stand vertically while
thawing. Refer to the Syringe Thaw Time chart for the thaw time
recommendation.
DO NOT open the container before contents reach ambient
temperature. Any moisture that collects on the thawed container
should be removed prior to opening the container.
DO NOT re-freeze. Once thawed to room temperature, the
adhesive should not be re-frozen.
CAUTION: This product may cause skin irritation in sensitive persons. Avoid skin contact. If contact does occur, wash area immediately with soap and water. Please refer to the Material Safety Data Sheet for more details.
20021 Susana Road, Rancho Dominguez, CA 90221
(310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783
The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every case we recommend that purchasers before
using any product conduct their own tests to determine whether the product is suitable for their particular purposes under their own operating conditions. No representative of ours has any
authority to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained
herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without
the authority from the owner of this patent. These materials are not designed or manufactured for implantation in the human body. Approval from FDA for such use as part of any product
to be implanted in the human body has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American Chemistry
Council’s Responsible Care
®
program.
For a technical contact nearest you, visit
www.ablestik.com
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