EEWORLDEEWORLDEEWORLD

Part Number

Search

86401

Description
FlexPlane™ Optical Circuitry
File Size78KB,1 Pages
ManufacturerMolex
Websitehttps://www.molex.com/molex/home
Download Datasheet View All

86401 Online Shopping

Suppliers Part Number Price MOQ In stock  
86401 - - View Buy Now

86401 Overview

FlexPlane™ Optical Circuitry

FEATURES AND SPECIFICATIONS
Features and Benefits
Diverse substrate size, shape and packaging
provides efficient and manageable solution to
high fiber count systems
Compatible with mass and discrete fiber
terminations ensuring a customized solution
Available in virtually any routing scheme
provides a variety of design alternatives
Direct or fusion splice terminations eliminate
additional insertion loss
Singlemode, multimode or hybrid versions
provide variety of options
Applications
Computing Equipment
Telecommunication Equipment
- Transmission
- Switching
- Multiplexing
Broadband Equipment
- Amplifiers
Reference Information
Telecordia GR-20 compliant
Use with: MT, MTP*, MPO, MT-RJ,
SMC, LC, FC, ST
, SC, MU, BMTP
and HBMT
TM
connector families
FlexPlane™
Optical Circuitry
86401
*MTP is a registered trademark of US Conec Ltd.
†ST is a trademark of Lucent Technologies
Molex’s FlexPlane optical flex circuit provides one of the highest density and versatile interconnect systems on the market today. For high fiber count
interconnects in backplanes and cross-connect systems, the FlexPlane’s high density routing on a flexible, flame-retardant substrate provides a manageable
means of fiber routing from card-to-card or shelf to shelf. A variety of interconnects including blind mating MT and MTP based connectors can be used to
connect the optical flex circuits to individual cards in a shelf.
Available in any routing scheme, fiber can be routed point-to-point, in a shuffle, or in a logical pattern. Direct or fusion-spliced terminations are available.
Non-fusion splice lead lengths are available up to two meters. Molex provides a variety of FlexPlane interconnect options including: MT, MTP, MPO, MT-RJ,
SMC, LC, FC, ST, SC, MU, up to 12 fiber Backplane MTP (BMTP) and up to 96 fiber High Density Backplane MT (HBMT).
Packaging alternatives include standard bare flexible substrate sandwiched in FR-4 or custom laminating. Each FlexPlane circuit can be fully tested down to
the per port insertion loss and return loss.
ORDERING INFORMATION
Order Number
86401-XXXX
Description
Contact Inside Sales for Ordering Information
Americas Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
1-800-78MOLEX
amerinfo@molex.com
Order No. USA-186 Rev. 4
Far East North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
feninfo@molex.com
Far East South Headquarters
Jurong, Singapore
65-6-268-6868
fesinfo@molex.com
European Headquarters
Munich, Germany
49-89-413092-0
eurinfo@molex.com
Corporate Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
630-969-4550
Visit our Web site at http://www.molex.com/fiber
Printed in USA/0K/EL/2003.02
©2003, Molex

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2659  1559  1135  2887  994  54  32  23  59  21 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号