IC OT PLD, 4 ns, CQFP24, CERPACK-24, Programmable Logic Device
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | QFF, QFL24,.4SQ |
| Reach Compliance Code | unknow |
| Architecture | PAL-TYPE |
| JESD-30 code | S-GQFP-F24 |
| JESD-609 code | e0 |
| length | 9.398 mm |
| Dedicated input times | 16 |
| Number of I/O lines | |
| Number of entries | 16 |
| Output times | 4 |
| Number of product terms | 32 |
| Number of terminals | 24 |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 16 DEDICATED INPUTS, 0 I/O |
| Output function | COMBINATORIAL |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | QFF |
| Encapsulate equivalent code | QFL24,.4SQ |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -5.2 V |
| Programmable logic type | OT PLD |
| propagation delay | 4 ns |
| Certification status | Not Qualified |
| Maximum seat height | 2.16 mm |
| surface mount | YES |
| technology | ECL |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 9.398 mm |
| PAL1016P4AWC | PAL10016P4AJC | PAL10016P4AWC | |
|---|---|---|---|
| Description | IC OT PLD, 4 ns, CQFP24, CERPACK-24, Programmable Logic Device | IC OT PLD, 4 ns, CDIP24, 0.300 INCH, THIN, CERAMIC, DIP-24, Programmable Logic Device | IC OT PLD, 4 ns, CQFP24, CERPACK-24, Programmable Logic Device |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | QFF, QFL24,.4SQ | DIP, DIP24,.3 | QFF, QFL24,.4SQ |
| Reach Compliance Code | unknow | unknown | unknown |
| Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| JESD-30 code | S-GQFP-F24 | R-GDIP-T24 | S-GQFP-F24 |
| JESD-609 code | e0 | e0 | e0 |
| Dedicated input times | 16 | 16 | 16 |
| Number of entries | 16 | 16 | 16 |
| Output times | 4 | 4 | 4 |
| Number of product terms | 32 | 32 | 32 |
| Number of terminals | 24 | 24 | 24 |
| Maximum operating temperature | 75 °C | 85 °C | 85 °C |
| organize | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O | 16 DEDICATED INPUTS, 0 I/O |
| Output function | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | QFF | DIP | QFF |
| Encapsulate equivalent code | QFL24,.4SQ | DIP24,.3 | QFL24,.4SQ |
| Package shape | SQUARE | RECTANGULAR | SQUARE |
| Package form | FLATPACK | IN-LINE | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | -5.2 V | -4.5 V | -4.5 V |
| Programmable logic type | OT PLD | OT PLD | OT PLD |
| propagation delay | 4 ns | 4 ns | 4 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.16 mm | 5.715 mm | 2.16 mm |
| surface mount | YES | NO | YES |
| technology | ECL | ECL100K | ECL |
| Temperature level | COMMERCIAL EXTENDED | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 9.398 mm | 7.62 mm | 9.398 mm |
| Maker | National Semiconductor（TI ） | - | National Semiconductor（TI ） |
| length | 9.398 mm | - | 9.398 mm |
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