SCANSTA101SMX/NOPB datasheet, PDF

SCANSTA101SMX/NOPB: DescriptionIC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA49, BGA-49, Microprocessor IC:Other; CategoryThe embedded processor and controller Microcontrollers and processors; File Size383KB，32 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Environmental Compliance

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SCANSTA101SMX/NOPB Overview

IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA49, BGA-49, Microprocessor IC:Other

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	National Semiconductor（TI ）
package instruction	BGA-49
Reach Compliance Code	unknow
ECCN code	EAR99
JESD-30 code	S-PBGA-B49
JESD-609 code	e1
length	7 mm
Humidity sensitivity level	4
Number of terminals	49
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA49,7X7,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

	SCANSTA101SMX/NOPB	SCANSTA101SM/NOPB
Description	IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA49, BGA-49, Microprocessor IC:Other	IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA49, BGA-49, Microprocessor IC:Other
Is it Rohs certified?	conform to	conform to
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	BGA-49	LFBGA, BGA49,7X7,32
Reach Compliance Code	unknow	compli
ECCN code	EAR99	EAR99
JESD-30 code	S-PBGA-B49	S-PBGA-B49
JESD-609 code	e1	e1
length	7 mm	7 mm
Humidity sensitivity level	4	4
Number of terminals	49	49
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA
Encapsulate equivalent code	BGA49,7X7,32	BGA49,7X7,32
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.5 mm	1.5 mm
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40
width	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

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