SCANSTA112VSX/NOPB datasheet, PDF

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SCANSTA112VSX/NOPB: DescriptionIC SPECIALTY MICROPROCESSOR CIRCUIT, PQFP100, TQFP-100, Microprocessor IC:Other; CategoryThe embedded processor and controller Microcontrollers and processors; File Size683KB，15 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Environmental Compliance

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SCANSTA112VSX/NOPB Overview

IC SPECIALTY MICROPROCESSOR CIRCUIT, PQFP100, TQFP-100, Microprocessor IC:Other

SCANSTA112VSX/NOPB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	National Semiconductor（TI ）
package instruction	TFQFP, TQFP100,.63SQ
Reach Compliance Code	compli
ECCN code	EAR99
JESD-30 code	S-PQFP-G100
JESD-609 code	e3
length	14 mm
Humidity sensitivity level	2
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Encapsulate equivalent code	TQFP100,.63SQ
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

SCANSTA112VSX/NOPB Related Products

	SCANSTA112VSX/NOPB	SCANSTA112SM/NOPB	SCANSTA112SMX/NOPB	SCANSTA112VS/NOPB
Description	IC SPECIALTY MICROPROCESSOR CIRCUIT, PQFP100, TQFP-100, Microprocessor IC:Other	IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA100, FBGA-100, Microprocessor IC:Other	IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA100, BGA-100, Microprocessor IC:Other	IC SPECIALTY MICROPROCESSOR CIRCUIT, PQFP100, TQFP-100, Microprocessor IC:Other
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	TFQFP, TQFP100,.63SQ	FBGA-100	LFBGA, BGA100,10X10,32	TQFP-100
Reach Compliance Code	compli	unknow	compli	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99
JESD-30 code	S-PQFP-G100	S-PBGA-B100	S-PBGA-B100	S-PQFP-G100
JESD-609 code	e3	e1	e1	e3
length	14 mm	10 mm	10 mm	14 mm
Humidity sensitivity level	2	4	4	3
Number of terminals	100	100	100	100
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFQFP	LFBGA	LFBGA	TFQFP
Encapsulate equivalent code	TQFP100,.63SQ	BGA100,10X10,32	BGA100,10X10,32	TQFP100,.63SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.5 mm	1.5 mm	1.2 mm
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn)
Terminal form	GULL WING	BALL	BALL	GULL WING
Terminal pitch	0.5 mm	0.8 mm	0.8 mm	0.5 mm
Terminal location	QUAD	BOTTOM	BOTTOM	QUAD
Maximum time at peak reflow temperature	40	40	40	NOT SPECIFIED
width	14 mm	10 mm	10 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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