NSWC103J100TRC3NF datasheet, PDF

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NSWC103J100TRC3NF: DescriptionFilm Capacitor, Polyethylene Naphthalate, 100V, 5% +Tol, 5% -Tol, 0.01uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT; CategoryPassive components capacitor; File Size94KB，3 Pages; ManufacturerNichicon; Websitehttp://www.nichicon.co.jp; Environmental Compliance

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NSWC103J100TRC3NF Overview

Film Capacitor, Polyethylene Naphthalate, 100V, 5% +Tol, 5% -Tol, 0.01uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT

NSWC103J100TRC3NF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Nichicon
package instruction	, 1210
Reach Compliance Code	compli
ECCN code	EAR99
capacitance	0.01 µF
Capacitor type	FILM CAPACITOR
dielectric materials	POLYETHYLENE NAPHTHALATE
high	2.1 mm
JESD-609 code	e1
length	3.2 mm
Manufacturer's serial number	NSWC
Installation features	SURFACE MOUNT
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	105 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, EMBOSSED PLASTIC
positive tolerance	5%
Rated (DC) voltage (URdc)	100 V
series	NSWC
size code	1210
surface mount	YES
Terminal shape	WRAPAROUND
width	2.5 mm

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Stacked Film Capacitor Chips

NSWC Series

FEATURES

NSWC IS

• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM

RECOMMENDED

• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES

FOR NEW DESIGNS

• WIDE TEMPERATURE RANGE UP TO +125

• HIGH HEAT AND MOISTURE RESISTANT

RoHS

• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS

Compliant

includes all homogeneous materials

nCHARACTERISTICS

• REFLOW SOLDERING ONLY

*See Part Number System for Details

• TAPE AND REEL PACKAGING

SPECIFICATIONS

Capacitance Range

Votage Ratings

Capacitance Tolerance

Temperature Range

Dissipation factor (20°C)

Insulation resistance (20°C)

Dielectric Withstanding

Voltage

1206

0.001 ~ 0.0047μF

Case Sizes

1913

2416

2820

3022

3925

1210

0.0056 ~ 0.01μF 0.012 ~ 0.082μF 0.1 ~ 0.15μF 0.18 ~ 0.33μF 0.39 ~ 0.47μF 0.56 ~ 1.0μF

100Vdc

0.001 ~ 0.01μF 5% (J) only,

0.012 ~ 0.15μF 5% (J) or 10% (K), 0.18 ~ 1.0μF 10% (K) only

-55°C ~ +105°C (0.001μF ~ 0.01μF)

-55°C ~ +125°C (0.012μF ~ 1.0μF with derating above +85°C)

1.0% max. @ 1KHz

3 Gigohms or 1000Ω/F whichever is lower

150% of Rated Voltage 60 Seconds

ENVIRONMENTAL CHARACTERISTICS

Life Test At +105°C

1,000 Hours at 125% of Rated Voltage

(125°C for 0.012μF ~ 1.0μF)

Resistance to Soldering Heat:

+240°C Peak

Humidity Load Life (90% ~ 95% RH)

(1) 1,000 Hours, +40°C

500 Hours for 0.012μF ~ 1.0μF

(2) 500 Hours, +60°C

for 0.001 ~ 0.01μF

Solderability with

25% Wt Rosin-Methanol Flux

Capacitance Change

Dissipation Factor

Insulation Resistance

Capacitance Change

Dissipation Factor

Insulation Resistance

Capacitance Change

Dissipation Factor

Insulation Resistance

Within +1%/-6% of Initial Value

1.1% Maximum

1 Gigohm Minimum or 300Ω/F whichever is lower

Within ±5% for 0.012 ~ 1.0μF or ±3% for 0.001 ~ 0.01μF of initial value

1.1% Max. for 0.012 ~ 1.0μF or 0.66% Max. for 0.001 ~ 0.01μF

1 Gigohm Minimum or 300Ω/F whichever is lower

(1) +8%/-5%

(2) ±10% of Initial Value

(1) 1.5% Max.

(2) 2.0% Max.

(1) 100 Megohm Min. or 30Ω/F

(2) 10 Megohm Min. or 3Ω/F

whichever is lower

90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot

RECOMMENDED LAND

PATTERN (mm)

Temperature - Deg. C

EIA Size

1206

1210

1913

2416

2820

3022

3925

1.8

2.6

3.8

4.5

5.1

7.2

3.6

6.6

7.8

9.0

9.7

11.9

1.4

2.3

3.0

3.8

4.6

5.0

5.7

RECOMMENDED REFLOW PROFILE

300

250

200

150

100

Ramp-up

25°C ~ 150°C

90 sec. max.

Pre-heat

150°C ~ 180°C

120 sec. max.

Cool Down

Time above 220°C

60 sec. max.

Standard: +240 °C Peak Temperature

+250°C Special Order

(see part numbering system)

Time

PART NUMBER SYSTEM

NSWC 823 J 100 TR D4 N F

RoHS Compliant

Optional High Temp. Reﬂow (+250°C)*

Size Code

Tape & Reel

Voltage

Tolerance Code: J = ±5%

Capacitance in pF, 1st two digits are

signiﬁcant, 3rd digit is no. of zeros

Series

*Special packaging and handling required.

NIC COMPONENTS CORP.

www.niccomp.com

www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

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