XPC823ECZT66B2 datasheet, PDF - EEWORLD Datasheet

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XPC823ECZT66B2: Description32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，1353 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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XPC823ECZT66B2 Overview

32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256

XPC823ECZT66B2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256
Contacts	256
Reach Compliance Code	_compli
ECCN code	3A991
Address bus width	26
bit size	32
boundary scan	YES
maximum clock frequency	5 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B256
JESD-609 code	e0
length	23 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	256
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,23X23,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	220
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.35 mm
speed	66 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	23 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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PowerPC

™

MPC823e

Reference Manual

The Microprocessor for Mobile Computing

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different

applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not

convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in

systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the

Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended

or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all

claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with

such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and

are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

Revision 0

TABLE OF CONTENTS

Paragraph

Number

Title

Section 1

Introduction

1.1

1.2

1.2.1

1.2.2

1.2.3

1.2.4

1.2.4.1

1.2.4.2

1.3

1.4

1.5

1.6

1.7

1.8

Features ................................................................................................1-1

Architecture ...........................................................................................1-6

The Embedded PowerPC Core ..................................................1-8

The System Interface Unit ..........................................................1-8

The Communication Processor Module .....................................1-9

The Video/LCD Controller ........................................................1-10

The Video Controller .....................................................1-10

The LCD Controller .......................................................1-10

The PCMCIA-ATA Controller ..............................................................1-10

Power Management ............................................................................1-11

System Debug Support .......................................................................1-11

Applications .........................................................................................1-11

Differences Between MPC823 (Rev B) and MPC823e .......................1-12

MPC823e Glueless System Design ....................................................1-12

Section 2

External Signals

2.1

The System Bus Signals .......................................................................2-2

Section 3

Memory Map

Section 4

Reset

4.1

4.1.1

4.1.2

4.1.3

4.1.3.1

4.1.3.2

4.1.3.3

4.1.3.4

4.1.3.5

Types of Reset ......................................................................................4-2

Power-On Reset .........................................................................4-2

External Hard Reset ...................................................................4-3

Internal Hard Reset ....................................................................4-3

Loss of Lock ....................................................................4-3

Software Watchdog Reset ..............................................4-3

Checkstop Reset ............................................................4-3

Debug Port Hard Reset ..................................................4-4

JTAG Reset ....................................................................4-4

Page

Number

MOTOROLA

MPC823e REFERENCE MANUAL

TABLE OF CONTENTS (Continued)

Paragraph

Number

4.1.4

4.1.5

4.1.5.1

4.2

4.3

4.3.1

4.3.1.1

4.3.2

Title

Page

Number

External Soft Reset .................................................................... 4-4

Internal Soft Reset ..................................................................... 4-4

Debug Port Soft Reset .................................................... 4-4

Reset Status Register ........................................................................... 4-5

How to Configure Reset ........................................................................ 4-7

Hard Reset ................................................................................. 4-7

Hard Reset Configuration Word ................................... 4-10

Soft Reset ................................................................................ 4-12

Section 5

Clocks and Power Control

5.1

5.2

5.2.1

5.2.2

5.3

5.3.1

5.3.2

5.3.2.1

5.3.3

5.3.4

5.3.4.1

5.3.4.2

5.3.4.3

5.3.4.4

5.3.5

5.3.5.1

5.3.5.2

5.4

5.4.1

5.4.2

5.4.2.1

5.4.2.2

5.5

Features ................................................................................................ 5-1

System Clock and Reset Control Register ................................. 5-3

PLL, Low-Power, and Reset Control Register ........................... 5-7

The Clock Module ............................................................................... 5-10

On-Chip Oscillators and External Clock Input .......................... 5-12

System PLL .............................................................................. 5-12

SPLL Stability ............................................................... 5-13

The Low-Power Clock Divider .................................................. 5-14

Internal Clock Signals .............................................................. 5-16

The General System Clocks ......................................... 5-16

The Baud Rate Generator Clock .................................. 5-19

The Synchronization Clocks ......................................... 5-20

The LCD Clocks ........................................................... 5-21

Clock Configuration .................................................................. 5-22

Mode Clock Pins ........................................................... 5-22

The System Phase-Locked Loop Pins ......................... 5-23

Power Control ..................................................................................... 5-24

Power Rails .............................................................................. 5-24

Keep-Alive Power ..................................................................... 5-25

Power Switching Example ............................................ 5-26

Low-Power Operation ......................................................................... 5-28

Section 6

The PowerPC Core

6.1

6.2

6.2.1

Features ................................................................................................ 6-1

Basic Structure of the Core ................................................................... 6-2

Instruction Flow Within the Core ................................................ 6-2

MPC823e REFERENCE MANUAL

MOTOROLA

TABLE OF CONTENTS (Continued)

Paragraph

Number

6.2.2

6.3

6.3.1

6.3.2

6.3.3

6.3.4

6.3.4.1

6.3.5

6.3.6

6.3.6.1

6.3.7

6.3.7.1

6.3.8

6.4

6.4.1

6.4.1.1

6.4.1.2

6.4.1.2.1

6.4.1.2.2

6.4.1.2.3

6.4.1.3

6.4.1.3.1

6.4.1.3.2

6.5

6.5.1

6.6

6.6.1

6.6.2

6.6.3

6.6.4

6.6.5

6.6.6

6.6.7

6.6.8

6.6.9

6.6.10

6.6.11

6.6.12

6.6.13

6.6.13.1

Title

Page

Number

Basic Instruction Pipeline ...........................................................6-4

Sequencer Unit .....................................................................................6-4

Flow Control ...............................................................................6-5

Issuing Instructions .....................................................................6-6

Interrupts ....................................................................................6-7

Implementing the Precise Exception Model ...............................6-8

Restartability After An Interrupt .....................................6-10

Processing an Interrupt ............................................................6-11

Serialization ..............................................................................6-12

Latency .........................................................................6-12

The External Interrupt ...............................................................6-13

Latency .........................................................................6-13

Interrupt Ordering .....................................................................6-14

The Register Unit ................................................................................6-15

Control Registers ......................................................................6-16

Physical Location of Special Registers .........................6-19

PowerPC Standard Control Register Bit Assignment ....6-20

Machine State Register ....................................6-20

The Condition Register ....................................6-22

Fixed-Point Exception Cause Register ............6-23

Initializing the Control Registers ...................................6-24

System Reset Interrupt ....................................6-24

Hard/Soft Reset ................................................6-24

The Fixed-Point Unit ...........................................................................6-24

XER Update In Divide Instructions ...........................................6-24

The Load/Store Unit ............................................................................6-25

Issuing Load/Store Instructions ................................................6-26

Serializing Load/Store Instructions ...........................................6-27

Instructions Issued to the Data Cache .....................................6-27

Issuing Store Instruction Cycles ...............................................6-27

Issuing Nonspeculative Load Instructions ................................6-27

Executing Unaligned Instructions .............................................6-28

Little-Endian Mode Support ......................................................6-29

Atomic Update Primitives .........................................................6-29

Instruction Timing .....................................................................6-30

Stalling Storage Control Instructions ........................................6-30

Accessing Off-Core Special Registers .....................................6-30

Storage Control Instructions .....................................................6-31

Exceptions ................................................................................6-31

DAR, DSISR, and BAR Operation ................................6-31

Section 7

MOTOROLA

MPC823e REFERENCE MANUAL

iii

XPC823ECZT66B2 Related Products

	XPC823ECZT66B2	XPC823EZT66B2	XPC823EZT75B2
Description	32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256	IC,MICROPROCESSOR,32-BIT,BGA,256PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,BGA,256PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP
Parts packaging code	BGA	BGA	BGA
package instruction	23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256	23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256	23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256
Contacts	256	256	256
Reach Compliance Code	_compli	not_compliant	_compli
ECCN code	3A991	3A991	3A991
Address bus width	26	26	26
bit size	32	32	32
boundary scan	YES	YES	YES
maximum clock frequency	5 MHz	5 MHz	5 MHz
External data bus width	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
JESD-609 code	e0	e0	e0
length	23 mm	23 mm	23 mm
low power mode	YES	YES	YES
Humidity sensitivity level	3	3	3
Number of terminals	256	256	256
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA
Encapsulate equivalent code	BGA256,23X23,50	BGA256,23X23,50	BGA256,23X23,50
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	220	220	220
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.35 mm	2.35 mm	2.35 mm
speed	66 MHz	66 MHz	75 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)	Tin/Lead/Silver (Sn/Pb/Ag)	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30
width	23 mm	23 mm	23 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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