EEWORLDEEWORLDEEWORLD

Part Number

Search

MSC23109B-10DS3

Description
Fast Page DRAM Module, 1MX9, 100ns, CMOS, SIMM-30
Categorystorage    storage   
File Size163KB,7 Pages
ManufacturerOKI
Websitehttp://www.oki.com
Download Datasheet Parametric Compare View All

MSC23109B-10DS3 Overview

Fast Page DRAM Module, 1MX9, 100ns, CMOS, SIMM-30

MSC23109B-10DS3 Parametric

Parameter NameAttribute value
MakerOKI
Parts packaging codeSIMM
package instruction,
Contacts30
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFAST PAGE
Maximum access time100 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE
JESD-30 codeR-XSMA-N30
memory density9437184 bi
Memory IC TypeFAST PAGE DRAM MODULE
memory width9
Number of functions1
Number of ports1
Number of terminals30
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX9
Output characteristics3-STATE
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
refresh cycle1024
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationSINGLE

MSC23109B-10DS3 Related Products

MSC23109B-10DS3 MSC23109BL-80DS3 MSC23109BL-70DS3 MSC23109B-60DS3 MSC23109BL-10DS3 MSC23109B-80DS3
Description Fast Page DRAM Module, 1MX9, 100ns, CMOS, SIMM-30 Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 Fast Page DRAM Module, 1MX9, 70ns, CMOS, SIMM-30 Fast Page DRAM Module, 1MX9, 60ns, CMOS, SIMM-30 Fast Page DRAM Module, 1MX9, 100ns, CMOS, SIMM-30 Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30
Parts packaging code SIMM SIMM SIMM SIMM SIMM SIMM
Contacts 30 30 30 30 30 30
Reach Compliance Code unknow unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 100 ns 80 ns 70 ns 60 ns 100 ns 80 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE
JESD-30 code R-XSMA-N30 R-XSMA-N30 R-XSMA-N30 R-XSMA-N30 R-XSMA-N30 R-XSMA-N30
memory density 9437184 bi 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bi
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 30 30 30 30 30 30
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 1024 1024 1024 1024 1024 1024
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Maker OKI - OKI OKI OKI OKI
How do satellite communications work from space?
How do satellite communications work from space?The International Space Station (ISS) orbits the Earth about 217 miles (350 kilometers) above the Earth's surface. That's about 1,148,294 feet (yes, ove...
btty038 RF/Wirelessly
DSP burnt out
Today, when I was almost done, I forgot to turn off the power due to a mistake, and the board burned when I connected the signal cable! ! ! ! ! ! ! ! !...
gaoxiao Microcontroller MCU
Domestic core TLSR8285 / TLSR8278 multi-protocol wireless chip
[i=s]This post was last edited by damiaa on 2020-9-8 10:46[/i]Domestic core TLSR8285 / TLSR8278 multi-protocol wireless chip It's a Shanghai company, and it uses English language. Telink’s new generat...
damiaa Domestic Chip Exchange
Hiring embedded software engineer
Headhunting position [Shenzhen] Job responsibilities 1. Responsible for linux application and driver development; 2. Linux kernel, file system, Uboot porting and optimization; 3. Writing documents rel...
ff318421749 Recruitment
How to read files with TSP as suffix
I'm a newbie, I downloaded it from TI official website, but I don't know what this file is. Then some user manuals can't be downloaded....
wangren09 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 958  1534  1329  94  1749  20  31  27  2  36 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号