Microprocessor, 16-Bit, 40MHz, CMOS, DIP-64
| Parameter Name | Attribute value |
| Maker | Pyramid Semiconductor Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 64 |
| Reach Compliance Code | unknow |
| ECCN code | 3A001.A.2.C |
| Other features | 2.5 MIPS USAF DAIS MIX |
| Address bus width | 16 |
| bit size | 16 |
| boundary scan | NO |
| maximum clock frequency | 40 MHz |
| External data bus width | 16 |
| Format | FLOATING POINT |
| Integrated cache | NO |
| JESD-30 code | R-XDIP-T64 |
| length | 42.2402 mm |
| low power mode | YES |
| Number of DMA channels | |
| Number of external interrupt devices | 8 |
| Number of serial I/Os | |
| Number of terminals | 64 |
| On-chip data RAM width | |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| speed | 40 MHz |
| Maximum slew rate | 340 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
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