5962-01-177-2464 datasheet, PDF

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5962-01-177-2464: DescriptionIC,BUFFER/DRIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,CERAMIC; Categorylogic logic; File Size57KB，1 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962-01-177-2464 Overview

IC,BUFFER/DRIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,CERAMIC

5962-01-177-2464 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP20,.3
Reach Compliance Code	_compli
Control type	ENABLE LOW
JESD-30 code	R-XDIP-T20
Logic integrated circuit type	BUS DRIVER
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Prop。Delay @ Nom-Su	55 ns
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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5962-01-177-2464 Related Products

	5962-01-177-2464	HD3-6436-9	HD1-6436-8	HD1-6436-2
Description	IC,BUFFER/DRIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,PLASTIC	HD1-6436-8	IC,BUFFER/DRIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Reach Compliance Code	_compli	not_compliant	not_compliant	not_compliant
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
JESD-30 code	R-XDIP-T20	R-PDIP-T20	R-XDIP-T20	R-XDIP-T20
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
Number of digits	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	20	20	20	20
Maximum operating temperature	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
JESD-609 code	-	e0	e0	e0
Prop。Delay @ Nom-Sup	-	55 ns	55 ns	55 ns
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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