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5962-01-221-2777

Description
IC,PROM,256X4,TTL,DIP,16PIN,CERAMIC
Categorystorage    storage   
File Size164KB,3 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

5962-01-221-2777 Overview

IC,PROM,256X4,TTL,DIP,16PIN,CERAMIC

5962-01-221-2777 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Reach Compliance Code_compli
Maximum access time75 ns
JESD-30 codeR-XDIP-T16
memory density1024 bi
Memory IC TypeOTP ROM
memory width4
Number of terminals16
word count256 words
character code256
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256X4
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
Maximum slew rate0.13 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Energy harvesting chips are becoming more and more popular
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The long road of blind dating ------ the latest update on October 19th~~
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About Database
[code] #include "ca_mergex20.h" #pragma comment(lib,"oleaut32.lib") #pragma comment(lib,"ole32.lib") ...... HRESULT hr; //Initialize COM hr = CoInitializeEx (NULL,COINIT_MULTITHREADED);//?Initialize C...
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