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5962-01-250-1654

Description
IC,LOGIC MUX,DUAL,4-INPUT,HCT-CMOS,DIP,16PIN,CERAMIC
Categorylogic    logic   
File Size334KB,5 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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5962-01-250-1654 Overview

IC,LOGIC MUX,DUAL,4-INPUT,HCT-CMOS,DIP,16PIN,CERAMIC

5962-01-250-1654 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionDIP, DIP16,.3
Reach Compliance Code_compli
JESD-30 codeR-XDIP-T16
Load capacitance (CL)50 pF
Logic integrated circuit typeMULTIPLEXER
MaximumI(ol)0.006 A
Number of functions2
Number of entries4
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Prop。Delay @ Nom-Su60 ns
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

5962-01-250-1654 Related Products

5962-01-250-1654 CD54HC253F CD54HCT253F CD54HC253H CD54HCT253H
Description IC,LOGIC MUX,DUAL,4-INPUT,HCT-CMOS,DIP,16PIN,CERAMIC CD54HC253F CD54HCT253F CD54HC253H CD54HCT253H
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Reach Compliance Code _compli not_compliant not_compliant unknow unknow
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER
MaximumI(ol) 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A
Number of functions 2 2 2 2 2
Number of entries 4 4 4 4 4
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIE OR CHIP DIE OR CHIP
power supply 5 V 2/6 V 5 V 2/6 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
technology CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY
Is it Rohs certified? incompatible incompatible incompatible - -
package instruction DIP, DIP16,.3 - DIP, DIP16,.3 , DIE OR CHIP , DIE OR CHIP
JESD-30 code R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 - -
Number of terminals 16 16 16 - -
Package body material CERAMIC CERAMIC CERAMIC - -
encapsulated code DIP DIP DIP - -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - -
Package form IN-LINE IN-LINE IN-LINE - -
Prop。Delay @ Nom-Su 60 ns - - 53 ns 60 ns
Nominal supply voltage (Vsup) 5 V - 5 V - 5 V
surface mount NO NO NO - -
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE - -
Terminal pitch 2.54 mm 2.54 mm 2.54 mm - -
Terminal location DUAL DUAL DUAL - -
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