3.3 VOLT HIGH-DENSITY SUPERSYNC II™ NARROW BUS FIFO
512 x 18/1,024 x 9, 1,024 x 18/2,048 x 9
IDT72V223, IDT72V233
IDT72V243, IDT72V253
2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9
IDT72V263, IDT72V273
8,192 x 18/16,384 x 9, 16,384 x 18/32,768 x 9
IDT72V283, IDT72V293
32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
FEATURES:
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Choose among the following memory organizations:
IDT72V223
⎯
512 x 18/1,024 x 9
IDT72V233
⎯
1,024 x 18/2,048 x 9
IDT72V243
⎯
2,048 x 18/4,096 x 9
IDT72V253
⎯
4,096 x 18/8,192 x 9
IDT72V263
⎯
8,192 x 18/16,384 x 9
IDT72V273
⎯
16,384 x 18/32,768 x 9
IDT72V283
⎯
32,768 x 18/65,536 x 9
IDT72V293
⎯
65,536 x 18/131,072 x 9
Functionally compatible with the IDT72V255LA/72V265LA and
IDT72V275/72V285 SuperSync FIFOs
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (BGA Only)
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Pin to Pin compatible to the higher density of IDT72V2103/72V2113
Big-Endian/Little-Endian user selectable byte representation
5V tolerant inputs
Fixed, low first word latency
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Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (BGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 80-pin Thin Quad Flat Pack (TQFP) or a 100-pin Ball
Grid Array (BGA) (with additional features)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
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°
Green parts available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
*Available on the
BGA package only.
D
0
-D
n
(x9 or x18)
WEN
WCLK/WR
*
INPUT REGISTER
LD SEN
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
WRITE POINTER
RAM ARRAY
512 x 18 or 1,024 x 9
1,024 x 18 or 2,048 x 9
2,048 x 18 or 4,096 x 9
4,096 x 18 or 8,192 x 9
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
32,768 x 18 or 65,536 x 9
65,536 x 18 or 131,072 x 9
FLAG
LOGIC
READ POINTER
BE
IP
IW
OW
MRS
PRS
TCK
*
TRST
*
TMS
**
TDI
*
TDO
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
JTAG CONTROL
(BOUNDARY SCAN)
*
OE
Q
0
-Q
n
(x9 or x18)
REN
*
4666 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
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