K4H510838F
K4H511638F
Industrial
DDR SDRAM
512Mb F-die DDR SDRAM Specification
66 TSOP-II & 60 FBGA
with Lead-Free and Halogen-Free
(RoHS compliant)
Industrial Temp. -40 to 85°C
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE
CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER-
WISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOL-
OGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT
GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 1.1 February 2009
K4H510838F
K4H511638F
Table Contents
Industrial
DDR SDRAM
1.0 Key Features ................................................................................................................................ 4
2.0 Ordering Information ................................................................................................................... 4
3.0 Operating Frequencies................................................................................................................ 4
4.0 Pin Description ............................................................................................................................ 5
5.0 Package Physical Dimension ..................................................................................................... 6
6.0 Block Diagram (16Mb x8 I/O x4 Banks, 8Mb x16 I/O x4 Banks)............................................... 7
7.0 Input/Output Function Description ............................................................................................ 8
8.0 Command Truth Table................................................................................................................. 9
9.0 General Description................................................................................................................... 10
10.0 Absolute Maximum Rating...................................................................................................... 10
11.0 DC Operating Conditions ........................................................................................................ 10
12.0 DDR SDRAM IDD Spec Items & Test Conditions .................................................................. 11
13.0 Input/Output Capacitance ....................................................................................................... 11
14.0 Detailed test condition for DDR SDRAM IDD1 & IDD1 & IDD7A .......................................... 12
15.0 DDR SDRAM IDD spec table ................................................................................................... 13
16.0 AC Operating Conditions ........................................................................................................ 14
17.0 AC Overshoot/Undershoot specification for Address and Control Pins............................ 14
18.0 Overshoot/Undershoot specification for Data, Strobe and Mask Pins............................... 15
19.0 AC Timing Parameters & Specifications ............................................................................... 16
20.0 System Characteristics for DDR SDRAM .............................................................................. 17
21.0 Component Notes .................................................................................................................... 18
22.0 System Notes ........................................................................................................................... 20
23.0 IBIS : I/V Characteristics for Input and Output Buffers ........................................................ 21
Rev. 1.1 February 2009
K4H510838F
K4H511638F
Revision History
Revision
1.0
1.1
Industrial
DDR SDRAM
Year
2008
2009
- Release 1.0 version
- Added x8 TSOP
Month
December
February
History
Rev. 1.1 February 2009
K4H510838F
K4H511638F
1.0 Key Features
• VDD : 2.5V ± 0.2V, VDDQ : 2.5V ± 0.2V for DDR266, 333
• Double-data-rate architecture; two data transfers per clock cycle
Industrial
DDR SDRAM
• Bidirectional data strobe [DQS] (x4,x8) & [L(U)DQS] (x16)
• Four banks operation
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• MRS cycle with address key programs
-. Read latency : DDR266(2, 2.5 Clock), DDR333(2.5 Clock), DDR400(3 Clock)
-. Burst length (2, 4, 8)
-. Burst type (sequential & interleave)
• All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
• Data I/O transactions on both edges of data strobe
• Edge aligned data output, center aligned data input
• LDM,UDM for write masking only (x16)
• DM for write masking only (x4, x8)
• Auto & Self refresh
• 7.8us refresh interval(8K/64ms refresh)
•
Support Industrial Temp (-40 to 85°C)
• Maximum burst refresh cycle : 8
• 66pin TSOP II
Lead-Free & Halogen-Free
package
•
60ball FBGA
Lead-Free & Halogen-Free
package
•
RoHS compliant
2.0 Ordering Information
Part No.
Org.
Max Freq.
Interface
Package
K4H510838F - LI/PB3
K4H511638F - LI/PB3
K4H511638F - HI/PB3
64Mx8
32M x 16
B3(DDR333@CL=2.5)
B3(DDR333@CL=2.5)
B3(DDR333@CL=2.5)
SSTL_2
66pin TSOP II
66pin TSOP II
60ball FBGA
3.0 Operating Frequencies
B3(DDR333@CL=2.5)
Speed @CL2
Speed @CL2.5
Speed @CL3
CL-tRCD-tRP
133MHz
166MHz
-
2.5-3-3
DDR266@CL=2.5
100MHz
133MHz
-
2.5-3-3
Rev. 1.1 February 2009
K4H510838F
K4H511638F
4.0 Pin Description
Industrial
DDR SDRAM
66pin TSOP - II
32Mb x 16
64Mb x 8
V
DD
DQ
0
V
DDQ
DQ
1
DQ
2
V
SSQ
DQ
3
DQ
4
V
DDQ
DQ
5
DQ
6
V
SSQ
DQ
7
NC
V
DDQ
LDQS
NC
V
DD
NC
LDM
WE
CAS
RAS
CS
NC
BA
0
BA
1
AP/A
10
A
0
A
1
A
2
A
3
V
DD
V
DD
DQ
0
V
DDQ
NC
DQ
1
V
SSQ
NC
DQ
2
V
DDQ
NC
DQ
3
V
SSQ
NC
NC
V
DDQ
NC
NC
V
DD
NC
NC
WE
CAS
RAS
CS
NC
BA
0
BA
1
AP/A
10
A
0
A
1
A
2
A
3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
66
65
64
63
62
61
60
59
58
V
SS
DQ
7
V
SSQ
NC
DQ
6
V
DDQ
NC
DQ
5
V
SSQ
NC
DQ
4
V
DDQ
NC
NC
V
SSQ
DQS
NC
V
REF
V
SS
DM
CK
CK
CKE
NC
A
12
A
11
A
9
A
8
A
7
A
6
A
5
A
4
V
SS
V
SS
DQ
15
V
SSQ
DQ
14
DQ
13
V
DDQ
DQ
12
DQ
11
V
SSQ
DQ
10
DQ
9
V
DDQ
DQ
8
NC
V
SSQ
UDQS
NC
V
REF
V
SS
UDM
CK
CK
CKE
NC
A
12
A
11
A
9
A
8
A
7
A
6
A
5
A
4
V
SS
66Pin TSOPII
(400mil x 875mil)
(0.65mm Pin Pitch)
Bank Address
BA0~BA1
Auto Precharge
A10
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
512Mb TSOP-II Package Pinout
60ball FBGA (Top View)
1
2
3
7
8
9
VSSQ
DQ15
VSS
A
VDD
DQ0
VDDQ
DQ14
VDDQ
DQ13
B
DQ2
VSSQ
DQ1
DQ12
VSSQ
DQ11
C
DQ4
VDDQ
DQ3
DQ10
VDDQ
DQ9
D
DQ6
VSSQ
DQ5
DQ8
VSSQ
UDQS
E
LDQS
VDDQ
DQ7
VREF
VSS
UDM
F
LDM
VDD
NC
CK
CK
G
WE
CAS
A12
CKE
H
RAS
CS
A11
A9
J
BA1
BA0
A8
A7
K
A0
A10/AP
A6
A5
L
A2
A1
A4
VSS
M
VDD
A3
Organization
64Mx8
32Mx16
Row Address
A0~A12
A0~A12
Column Address
A0-A9, A11
A0-A9
DM is internally loaded to match DQ and DQS identically.
Row & Column address configuration
Rev. 1.1 February 2009
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