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S34ML02G100BHB003

Description
Flash, 256MX8, PBGA63, 11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63
Categorystorage    storage   
File Size3MB,77 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
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S34ML02G100BHB003 Overview

Flash, 256MX8, PBGA63, 11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63

S34ML02G100BHB003 Parametric

Parameter NameAttribute value
MakerSPANSION
package instruction11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
JESD-30 codeR-PBGA-B63
length11 mm
memory density2147483648 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals63
word count268435456 words
character code256000000
Operating modeASYNCHRONOUS
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
organize256MX8
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage3 V
Maximum seat height1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
typeSLC NAND TYPE
width9 mm
Spansion
®
SLC NAND Flash Memory for
Embedded
1 Gb, 2 Gb, 4 Gb Densities:
1-bit ECC, x8 and x16 I/O, 3V V
CC
S34ML01G1, S34ML02G1, S34ML04G1
Spansion
®
SLC NAND Flash Memory for Embedded Cover Sheet
Data Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S34ML01G1_04G1
Revision
17
Issue Date
November 22, 2013
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