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S71GL512NC0BAWET3

Description
Memory Circuit, 32MX16, CMOS, PBGA84, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84
Categorystorage    storage   
File Size2MB,122 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

S71GL512NC0BAWET3 Overview

Memory Circuit, 32MX16, CMOS, PBGA84, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

S71GL512NC0BAWET3 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA,
Contacts84
Reach Compliance Codecompli
Other featuresPSRAM IS ORGANIZED AS 4M X 16
JESD-30 codeR-PBGA-B84
JESD-609 codee0
length12 mm
memory density536870912 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals84
word count33554432 words
character code32000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width9 mm
S71GLxxxNC0
Stacked Multi-chip Product (MCP)
512/256/128 Megabit (32/16/8 M x 16-bit) CMOS 3.0 Volt-only
MirrorBit
TM
Page-mode Flash Memory
with 64 Megabit (4M x 16-bit) pSRAM
Data Sheet
ADVANCE
INFORMATION
Distinctive Characteristics
MCP Features
Power supply voltage of 2.7 to 3.1V
High Performance
100 ns access time (S71GL128N, S71GL256N)
110 ns access time (S71GL512N)
25 ns page read times
Packages:
— 9.0 x 12.0 mm x 1.2 mm FBGA (TLD084) (S71GL512N)
— 8.0 x 11.6 mm x 1.2 mm FBGA (TLA084) (S71GL128N, S71GL256N)
Operating Temperature
— -25°C to +85°C (Wireless)
General Description
The S71GL Series is a product line of stacked Multi-chip Product (MCP) packages
and consists of
One Flash memory die
One pSRAM
The products covered by this document are listed in the table below. For details
about their specifications, please refer to the individual constituent datasheets
for further details.
Flash Memory Density
512 Mb
pSRAM Density
64 Mb
S71GL512NC0
256 Mb
S71GL256NC0
128 Mb
S71GL128NC0
Publication Number
S71GL512_256_128NC0_00
Revision
A
Amendment
0
Issue Date
December 17, 2004
This document contains information on a product under development at Spansion LLC. The information is intended to help you evaluate this product. Spansion LLC
reserves the right to change or discontinue work on this proposed product without notice.

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