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S72NS128PD0AHBGC0

Description
Memory Circuit, 8MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
Categorystorage    storage   
File Size651KB,14 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

S72NS128PD0AHBGC0 Overview

Memory Circuit, 8MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133

S72NS128PD0AHBGC0 Parametric

Parameter NameAttribute value
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA,
Contacts133
Reach Compliance Codeunknow
Other featuresDRAM IS ORGANISED AS 8M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE
JESD-30 codeS-PBGA-B133
length8 mm
memory density134217728 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals133
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeSQUARE
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
width8 mm
S72NS-P MCP/PoP Memory System
Solutions
MirrorBit
®
Flash Memory and DRAM
128/256/512 Mb (8/16/32 M x 16 bit), 1.8 Volt-only, Multiplexed
Simultaneous Read/Write, Burst Mode Flash Memory
128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus
Data Sheet
(Advance Information)
S72NS-P MCP/PoP Memory System Solutions Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S72NS-P_00
Revision
05
Issue Date
February 14, 2008

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