EEWORLDEEWORLDEEWORLD

Part Number

Search

URG6432L-5230-D-T05

Description
Fixed Resistor, Thin Film, 0.75W, 523ohm, 300V, 0.5% +/-Tol, 2ppm/Cel, Surface Mount, 2512, CHIP
CategoryPassive components    The resistor   
File Size450KB,4 Pages
ManufacturerSUSUMU
Environmental Compliance
Download Datasheet Parametric View All

URG6432L-5230-D-T05 Overview

Fixed Resistor, Thin Film, 0.75W, 523ohm, 300V, 0.5% +/-Tol, 2ppm/Cel, Surface Mount, 2512, CHIP

URG6432L-5230-D-T05 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSUSUMU
package instructionCHIP
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresANTI-SULFUR, PRECISION
structureRectangul
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.45 mm
Package length6.4 mm
Package formSMT
Package width3.2 mm
method of packingTR, Embossed, 7 Inch
Rated power dissipation(P)0.75 W
Rated temperature70 °C
GuidelineAEC-Q200
resistance523 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
technologyTHIN FILM
Temperature Coefficient2 ppm/°C
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage300 V

URG6432L-5230-D-T05 Preview

Metal thin film chip resistors
■URG
series
Features
The tightest resistance tolerance: +/-0.01%
The smallest temperature coefficient of resistance: ±1ppm/℃
Thin film surface mount resistors
(the highest reliability and precision)
AEC-Q200 Compliant
Long term stability with inorganic passivation
Thin film structure enabling low noise and anti-sulfur
Applications
Industrial measurement, electrical scales
High precision sensors, medical electronics
URG series
◆Part
numbering system
URG 2012
Series code
Size: URG1608, URG2012,
URG3216, URG5025, URG6432
Temperature coefficient of resistance
L - 102 - L - T1
Packaging quantity: T1(1,000pcs),
T05(500pcs), T01(100pcs)
Resistance tolerance
Nominal resistance value (E-24: 3 digit, E-96: 4 digit,
URG3216, URG5025, URG6432: all 4 digit)
◆Electrical
Specification
Type
Power
ratings
Temperature
coefficient
of resistance
Resistance range(Ω) Resistance tolerance
±0.01% (L)
±0.02% (P) ±0.05% (W)
±0.1% (B)
±0.5% (D)
Maximum
voltage
Resistance
value series
Operating
temperature
Packaging
quantity
±1
(K)
*1
*2
URG1608
1/16W
±2
(L)
250 ≦R ≦7.5K
100≦R≦7.5k
100V
±1
(K)
*1
URG2012
1/10W
± (L)
*2
±1
(K)
*1
*2
*1
250 ≦R ≦36K
100≦R≦36k
150V
-55℃ ~
T1
URG3216
1/4W
± (L)
250 ≦R ≦68K
100≦R≦68k
200V
E24, E96
155℃
T05
T01
250 ≦R ≦100K
100≦R≦150k
300V
±1
(K)
URG5025
1/2W
± (L)
*2
±1
(K)
*1
*2
URG6432
3/4W
± (L)
250 ≦R ≦100K
100≦R≦200k
300V
*1: Applicable TCR K (±1.0) at temperature range 25℃∼ 65℃
Applicable TCR K (±1.5) at temperature range -20℃∼ 25℃, 65℃~125℃
*2: Applicable TCR L at temperature range -20℃∼ 125℃
*Contact us for requirements not listed in above table.
11
◆Dimensions
L
a
a
Type
(inch)
0603
Size
L
W
a
b
t
W
URG1608
1.60±0.20
0.80+0.25/−0.20
0.30±0.20
0.30±0.20
0.40+0.15/−0.10
URG2012
t
0805
2.00±0.20
1.25+0.25/−0.20
0.40±0.20
0.40±0.20
0.40+0.15/−0.10
Thin film surface mount resistors
URG3216
b
1206
3.20±0.20
1.60±0.25
0.50±0.25
0.50±0.20
0.40+0.15/−0.10
URG5025
2010
5.00±0.20
2.50±0.25
0.60±0.25
0.60±0.25
0.45±0.10
URG6432
2512
6.40+0.20/−0.40
3.20±0.25
0.75±0.25
0.80±0.20
0.45±0.20
URG series
(unit:mm)
◆Reliability
specification
Test items
Short time overload
Condition (test methods (MIL-PRF-55342/JIS C5201-1)
2.5 x rated voltage, 5seconds
*1
Standard
±0.02%+0.01Ω
±0.02%+0.01Ω(R≧250Ω)
±0.05%+0.01Ω(R<250Ω)
Life (biased)
70℃, rated voltage, 90min on 30min off, 2000hours
*1
High temperature high humidity
Temperature shock
High temperature exposure
Resistance to soldering heat
85℃, 85%RH, 1/10 of rated power, 90min on 30min off, 1000hours
-65℃ (15min) ∼ 150℃ (15min) 100cycles
155℃, no bias, 1000hours
235±5℃, 30 seconds (reflow), (by MIL-PRF-55342)
RxP
±0.05%+0.01Ω
±0.02%+0.01Ω
±0.05%+0.01Ω
±0.01%+0.01Ω
*1
Rated voltage is given by E=
E= rated voltage (V), R=nominal resistance value(Ω), P=rated power(W)
If rated voltage exceeds maximum voltage /element, maximum voltage/element is the rated voltage.
12
Metal thin film chip resistors
(the highest reliability and precision)
■URG
series
◆Reliability
test data
○Biased
life test
Thin film surface mount resistors
1000
800
URG2012
LL70℃_0.25W, n = 20
1000
800
URG3216
LL70℃_0.25W, n = 20
Resistance drift (ppm)
600
400
200
0
-200
-400
-600
-800
-1000
Resistance drift (ppm)
600
400
200
0
-200
-400
-600
-800
-1000
250Ω
20kΩ
1kΩ
32kΩ
10kΩ
250Ω
1kΩ
68kΩ
URG series
10           100           1000         10000
Test duration(h)
110           100           1000         10000
Test duration(h)
○High
temperature high humidity (biased)
500
400
URG2012
THB 85 ℃, 85 %, n = 20
500
400
URG3216
THB 85 ℃, 85 %, n = 20
Resistance drift (ppm)
300
200
100
0
-100
-200
-300
-400
-500
Resistance drift (ppm)
300
200
100
0
-100
-200
-300
-400
-500
250Ω
20kΩ
1kΩ
32kΩ
10kΩ
250Ω
1kΩ
68kΩ
10           100           1000         10000
Test duration(h)
10           100           1000         10000
Test duration(h)
○Temperature
shock
200
200
URG2012, n = 10
Thermal Shock_-65℃ to +150℃
150
100
50
0
-50
-100
-150
-200
250Ω
1kΩ
68kΩ
150
100
50
0
-50
-100
-150
-200
250Ω
1kΩ
68kΩ
URG3216, n = 10
Thermal Shock_ -65℃ to +150℃
Resistance drift (ppm)
Resistance drift (ppm)
10           10            100          1000
Number of cycles
10           10            100          1000
Number of cycles
○High
temperature exposure
500
400
URG2012, n = 20
High Temperature Exposure,155℃
500
400
URG3216, n = 20
High Temperature Exposure,155℃
Resistance drift (ppm)
300
200
100
0
-100
-200
-300
-400
-500
Resistance drift (ppm)
300
200
100
0
-100
-200
-300
-400
-500
250Ω
1kΩ
32kΩ
250Ω
1kΩ
68kΩ
10           100           1000         10000
Test duration(h)
10           100           1000         10000
Test duration(h)
13
◆Temperature
coefficient of Resistance
○URG2012
1000
800
Variation of resistance with temperature
URG2012-1kΩ
No.1
No.2
No.3
No.4
No.5
No.6
No.7
No.8
No.9
No.10
1000
800
Variation of resistance with temperature
URG2012-32kΩ
No.1
No.2
No.3
No.4
No.5
No.6
No.7
No.8
No.9
No.10
Resistance drift (ppm)
400
200
0
-200
-400
-600
-800
-1000
-75  -50  -25   0 
±2ppm / ℃
±5ppm / ℃
Resistance drift (ppm)
600
600
400
200
0
-200
-400
-600
-800
-1000
Thin film surface mount resistors
±2ppm / ℃
±5ppm / ℃
Ambient temperature (℃)
25 
50  75  100 125
150  175
-75  -50  -25   0 
Ambient temperature (℃)
25 
50  75  100 125
150  175
○URG3216
1000
800
Variation of resistance with temperature
URG3216-1kΩ
No.1
No.2
No.3
No.4
No.5
No.6
No.7
No.8
No.9
No.10
URG series
1000
800
Variation of resistance with temperature
URG3216-68kΩ
No.1
No.2
No.3
No.4
No.5
No.6
No.7
No.8
No.9
No.10
Resistance drift (ppm)
400
200
0
-200
-400
-600
-800
-1000
-75  -50  -25   0 
±2ppm / ℃
±5ppm / ℃
Resistance drift (ppm)
600
600
400
200
0
-200
-400
-600
-800
-1000
±2ppm / ℃
±5ppm / ℃
Ambient temperature (℃)
25 
50  75  100 125
150  175
-75  -50  -25   0 
Ambient temperature (℃)
25 
50  75  100 125
150  175
◆Derating
Curve
Ratio to rated power (%)
100
50
0
-55     0     50 70  100     155
Ambient temperature (℃)
14

Recommended Resources

How is this comparator with hysteresis implemented?
...
littleshrimp Analog electronics
Learn Analog + "Operational Amplifier Noise Optimization Handbook" - Chapter 2 Introduction to Operational Amplifier Noise
[i=s]This post was last edited by dontium on 2015-1-23 11:22[/i] [align=left]Chapter 2 Introduction to Op Amp Noise[/align][align=left]1. Explain the goal of op amp noise analysis technology: calculat...
shiyongzhu Analogue and Mixed Signal
【R7F0C809】Toy elevator demonstration (final chapter)
[i=s]This post was last edited by ltbytyn on 2015-10-14 14:22[/i] First, here is a picture of the front. The shelf was made by using a soldering iron to burn a groove in the plastic, and then a small ...
ltbytyn Renesas Electronics MCUs
Precautions for using chip ferrite beads
1. DC superposition characteristics of chip ferrite beads Chip ferrite beads are an inductor that uses ferrite. Therefore, when a large current passes through, special attention needs to be paid to pe...
Aguilera Analogue and Mixed Signal
How to deploy WCE program to the device?
Hello everyone. I just got started with WCE. I wrote a WCE program, developed with EVC, installed the WINCE5.0 SDK, and the program runs fine on the simulator (a simple HELLO WORLD program). But now I...
yll2008wd Embedded System
I2C Bus Application System Design [Out of Print]
基本信息* 作者: 何立民* 丛书名: 单片机应用技术丛书* 出版社:北京航空航天大学出版社* 出版日期:2002 年9月* 开本:16开* 页码:236内容简介串行扩展总线技术是新一代单片机技术发展的一个显著特点。其中Philips公司推出的I2C总线(Intel lC BUS)最为著名。与并行扩展总线相比,串行扩展总线有突出的优点:电路结构简单,程序编写方便,易于实现用户系统软硬件的模块比、标...
wzt MCU

Popular Articles

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1868  1201  459  1619  1034  38  25  10  33  21 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号