060322001P10CCR datasheet, PDF

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060322001P10CCR: DescriptionCeramic Capacitor, Multilayer, Ceramic, 200V, 22.73% +Tol, 22.73% -Tol, C0G, 30ppm/Cel TC, 0.0000011uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT; CategoryPassive components capacitor; File Size197KB，2 Pages; ManufacturerSyfer; Environmental Compliance

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060322001P10CCR Overview

Ceramic Capacitor, Multilayer, Ceramic, 200V, 22.73% +Tol, 22.73% -Tol, C0G, 30ppm/Cel TC, 0.0000011uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

060322001P10CCR Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Syfer
package instruction	, 0603
Reach Compliance Code	compli
ECCN code	EAR99
capacitance	0.0000011 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
JESD-609 code	e3
Manufacturer's serial number	0603
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	22.73%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
method of packing	TR, 13 INCH
positive tolerance	22.73%
Rated (DC) voltage (URdc)	200 V
size code	0603
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal surface	Matte Tin (Sn)
Terminal shape	WRAPAROUND

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MLCCs

for Non-

magnetic

applications

C0G/NP0, High Q and X7R

Copper Barrier MLCCs

Multilayer ceramic capacitors

with silver/palladium (Ag/Pd)

terminations have often been

used in medical applications

where non-magnetic

components are required, for

example in MRI equipment.

The use of conventional nickel

barrier terminations is not

suitable due to nickel exhibiting

magnetic properties.

However, RoHS requirements

have dictated the use of

lead-free solders, and the

composition of these solders

has resulted in an increase in

soldering temperatures. This

has caused solder leaching

problems for the Ag/Pd

termination, and meant

alternative terminations have

had to be found.

Specification

Capacitance Values

C0G/NP0 & High Q

0.1pF - 15nF

X7R

47pF - 6.8µF

See overleaf for full list of values

Mechanical

Termination Material

See ordering information below

Solderability

IEC 60068-2-58. Passed 3 times reflow

profile defined in J-STD-020

Printing

Consult sales office

Lead Free Soldering

Termination codes 2 and 3 ranges are

fully compliant with the RoHS and WEEE

directives and parts are compatible with lead

free solders.

Climatic Category

55/125/56

Reeled Quantities

See Capacitance tables overleaf

Electrical

C0G/NP0

-55°C to

+125°C

High Q

-55°C to

+125°C

X7R

-55°C to

+125°C

Operating Temperature

Temperature Coefficient

(Typical)

0 ± 30

ppm/°C

0 ± 30

ppm/°C

±15%

Insulation Resistance

Time constant (Ri xCr) (whichever is the least)

100GΩ or

1000s

Ageing Rate

None

Typical 1% per

time decade

100GΩ or

1000s

100GΩ or

1000s

Ordering Information

1210

Chip

size

0402

0603

0505

0805

1206

1111

1210

1808

1812

2220

2225

Termination

(for C0G/NP0

& High Q only)

= Sintered

silver base with

copper barrier

(100% matte tin

plating). RoHS

compliant.

100

Voltage

0103

Capacitance in

picofarads (pF)

Capacitance

tolerance

Dielectric

Packaging

___

Suffix

As copper is non-magnetic,

one solution is to use a copper

barrier instead of a nickel

barrier, with a tin finish on top,

and this is the solution Syfer

has developed.

This copper barrier termination

is offered with selected non-

magnetic C0G/NP0, High Q

and X7R dielectrics, providing a

fully non-magnetic component.

To meet high temperature

260ºC soldering reflow profiles

as detailed in J-STD-020, C0G/

NP0 dielectrics are supplied

with sintered termination and

X7R dielectrics are supplied

with Syfer’s award winning

FlexiCap™ termination.

41/09

016 = 16V <10pF Insert a P for

= C0G/

= 178mm Used for

<4.7pF

the decimal point, H = ±0.05pF NP0 (1B)

025 = 25V

(7”) reel

specific

050 = 50V

eg P300 = 0.3pF,

customer

B = ±0.1pF

= X7R

= 330mm

8P20 = 8.2pF.

063 = 63V

C = ±0.25pF

(2R1)

(13”) reel requirements

100 = 100V

D = ±0.5pF

10pF 1st digit

= High Q

= Bulk

150 = 150V

is 0. 2nd and

4.7pF &

pack - tubs

200 = 200V

3rd digits are

<10pF

250 = 250V significant figures

B = ±0.1pF

= FlexiCap™ 500 = 500V

of capacitance

C = ±0.25pF

630 = 630V code. The 4th digit D = ±0.5pF

base with

1K0 = 1000V is number of 0’s

copper barrier

10pF

(100% matte 1K2 = 1200V

following

F = ±1%

1K5 = 1500V

tin plating).

eg. 0103 =

G = ±2%

RoHS compliant. 2K0 = 2000V

10000pF

J = ±5%

3K0 = 3000V

K = ±10%

Values <1pF in

0.1pF steps, above

this values are E24

series

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