EEWORLDEEWORLDEEWORLD

Part Number

Search

1206Y10006R8BAB

Description
Ceramic Capacitor, Multilayer, Ceramic, 100V, 1.47% +Tol, 1.47% -Tol, C0G, 30ppm/Cel TC, 0.0000068uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size562KB,9 Pages
ManufacturerSyfer
Environmental Compliance  
Download Datasheet Parametric View All

1206Y10006R8BAB Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 1.47% +Tol, 1.47% -Tol, C0G, 30ppm/Cel TC, 0.0000068uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT

1206Y10006R8BAB Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSyfer
package instruction, 1206
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.0000068 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Manufacturer's serial number1206
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance1.47%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance1.47%
Rated (DC) voltage (URdc)100 V
GuidelineAEC-Q200
size code1206
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
Surface mount capacitors
1.1 to 1.3
1.1 - Production process flowchart
Ceramic powder
preparation
Electrode ink
material
1.2 - Syfer reliability grades
High reliability
(space quality)
Space
Grade
ESCC 3009
(1)
MIL Grade
(2)
IECQ-CECC
(3)
AEC-Q200
(4)
Standard components
Multilayer build
(wet process)
Fire
Standard
reliability
Rumble
Notes:
(1) Space grade tested in accordance with ESCC 3009. Refer to Syfer
specification S02A 0100.
Internal inspection
(2) MIL Grade. Released in accordance with US standards available on
request.
(3) IECQ-CECC. The International Electrotechnical Commission (IEC)
Quality Assessment System for Electronic Components. This is an
internationally recognised product quality certification which
provides customers with assurance that the product supplied
meets high quality standards.
View Syfer’s IECQ-CECC approvals at http://www.iecq.org or at
www.syfer.com
Termination
(if specified)
Plating
(4) AEC-Q200. Automotive Electronics Council Stress Test Qualification
For Passive Components. Refer to Syfer application note reference
AN0009.
Printing
(if specified)
1.3 - Syfer reliability surface mount product
groups
Electrical test
Tandem
FlexiCap
TM
capacitors
(1)
Open Mode
FlexiCap
TM
capacitors
(2)
Standard FlexiCap
TM
capacitors
(3)
Standard MLC capacitor
(4)
High reliability
Test verification
Additional sample
Rel tests
(if specified)
Standard
reliability
Notes:
QC inspection
Additional Hi Rel
activities
(S02A & S05
100% burn-in, QC insp)
(1) “Tandem” construction capacitors, ie internally having the
equivalent of 2 series capacitors. If one of these should fail
short-circuit, there is still capacitance end to end and the chip will
still function as a capacitor, although capacitance maybe affected.
Refer to application note AN0021. Also available qualified to
AEC-Q200.
(2) “Open Mode” capacitors with FlexiCap
TM
termination also reduce
the possibility of a short circuit by utilising inset electrode margins.
Refer to application note AN0022. Also available qualified to
AEC-Q200.
(3) Multilayer capacitors with Syfer FlexiCap
TM
termination. By using
FlexiCap
TM
termination, there is a reduced possibility of the
mechanical cracking occurring.
(4) “Standard” capacitors includes MLCCs with tin finish over nickel,
but no FlexiCap
TM
.
Packaging
4
Finished goods store
In a synchronous rectification circuit, what is the function of connecting an NMOS in reverse series to the lower bridge arm?
This is the schematic diagram I made by disassembling an MPPT charger before I graduated last year. The object I copied is a mature product on the market. This circuit has been verified to be function...
大小家伙好 Circuit Observation Room
Bluetooth 4.0, the secret of low power consumption
Why is Bluetooth Low Energy so power-efficient? According to the official SIG press conference, compared with classic Bluetooth technology, the main changes are concentrated in three aspects: reduced ...
jordum RF/Wirelessly
MSP430 study notes ADC12
[list=1] [*][backcolor=white]Several terms: [/backcolor] [/list] [align=left][color=rgb(69, 69, 69)]a) Resolution (LSB): Indicates the change in input analog voltage required for the output digital qu...
fish001 Microcontroller MCU
From a MCU beginner to a MCU engineer (a post that really makes you an engineer)
[backcolor=white] [/backcolor] [backcolor=white] [size=12px] I have been studying microcontrollers for several years. I would like to take this opportunity to talk to you about some of my experiences ...
maylove MCU
I don't understand this PPFC circuit (based on LLC to drive LED lights), please help.
[i=s]This post was last edited by giggsyao on 2016-10-11 10:58[/i] [align=left][color=#333333][font=微软雅黑]Hello everyone, I am new to PPFC circuit. This is an LLC solution to promote LED lamp circuit. ...
giggsyao LED Zone
Hard disk video recorder motherboard manufacturer
Can someone help me figure out what this OEM DVR motherboard is for? The APP platform uses the Dana platform: congratulate:...
zzm0828 Industrial Control Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1743  352  668  2596  2233  36  8  14  53  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号