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A3PE600-1FGG484PP

Description
IC,FPGA,38400-CELL,CMOS,BGA,484PIN,PLASTIC
Categorysemiconductor    Programmable logic devices   
File Size8MB,162 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

A3PE600-1FGG484PP Overview

IC,FPGA,38400-CELL,CMOS,BGA,484PIN,PLASTIC

A3PE600-1FGG484PP Parametric

Parameter NameAttribute value
Number of terminals484
Minimum operating temperature0.0 Cel
Maximum operating temperature70 Cel
stateActive
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
clock_frequency_max350 MHz
jesd_30_codeS-PBGA-B484
Number of inputs280
umber_of_logic_cells38400
Number of outputs280
Packaging MaterialsPLASTIC/EPOXY
ckage_codeBGA
ckage_equivalence_codeBGA484,22X22,40
packaging shapeSQUARE
Package SizeGRID ARRAY
wer_supplies1.5/3.3
qualification_statusCOMMERCIAL
sub_categoryField Programmable Gate Arrays
surface mountYES
CraftsmanshipCMOS
Temperature levelCommercial
Terminal formBALL
Terminal spacing1 mm
Terminal locationBOTTOM
Revision 13
ProASIC3E Flash Family FPGAs
with Optional Soft ARM Support
Features and Benefits
High Capacity
• 600 k to 3 Million System Gates
• 108 to 504 kbits of True Dual-Port SRAM
• Up to 620 User I/Os
Pro (Professional) I/O
700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—up to 8 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS
2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
Schmitt Trigger Option on Single-Ended Inputs
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the ProASIC
®
3E Family
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Instant On Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
On-Chip User Nonvolatile Memory
• 1 kbit of FlashROM with Synchronous Interfacing
High Performance
• 350 MHz System Performance
• 3.3 V, 66 MHz 64-Bit PCI
In-System Programming (ISP) and Security
• ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock
®
Designed to Secure FPGA Contents
Clock Conditioning Circuit (CCC) and PLL
• Six CCC Blocks, Each with an Integrated PLL
• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities
and External Feedback
• Wide Input Frequency Range (1.5 MHz to 350 MHz)
Low Power
• Core Voltage for Low Power
• Support for 1.5-V-Only Systems
• Low-Impedance Flash Switches
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• 24 SRAM and FIFO Configurations with Synchronous Operation
up to 350 MHz
• M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available
with or without Debug
High-Performance Routing Hierarchy
Segmented, Hierarchical Routing and Clock Structure
Ultra-Fast Local and Long-Line Network
Enhanced High-Speed, Very-Long-Line Network
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
ARM
®
Processor Support in ProASIC3E FPGAs
Table 1-1 • ProASIC3E Product Family
ProASIC3E Devices
Cortex-M1 Devices
1
System Gates
VersaTiles (D-flip-flops)
RAM Kbits (1,024 bits)
4,608-Bit Blocks
FlashROM Kbits
Secure (AES) ISP
CCCs with Integrated
VersaNet
Globals
3
I/O Banks
Maximum User I/Os
Package Pins
PQFP
FBGA
PLLs
2
600,000
13,824
108
24
1
Yes
6
18
8
270
PQ208
FG256, FG484
A3PE600
A3PE1500
M1A3PE1500
1,500,000
38,400
270
60
1
Yes
6
18
8
444
PQ208
FG484, FG676
A3PE3000
M1A3PE3000
3,000,000
75,264
504
112
1
Yes
6
18
8
620
PQ208
FG324
,
FG484, FG896
Notes:
1. Refer to the
Cortex-M1
product brief for more information.
2. The PQ208 package supports six CCCs and two PLLs.
3. Six chip (main) and three quadrant global networks are available.
4. For devices supporting lower densities, refer to the
ProASIC3 Flash Family FPGAs
datasheet.
January 2013
© 2013 Microsemi Corporation
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