Temperature Measurement
SMD NTC Thermistors with Silver Palladium Termination, Size 1206
Applications
I
Temperature measurement and
B57621
C 621
1,6±0,2
1,3 max.
compensation in
– hybrid circuits
– data systems
– telecom systems
– automotive electronics
Features
I
Silver palladium termination (AgPd)
I
Cost-effective
I
Suitable for wave and reflow soldering
3,2±0,2
Termination
0,5±0,25
TNT0398-F
Options
Alternative resistance ratings and resistance tolerance
<
5% available on request
Delivery mode
Dimensions in mm/Approx. weight 18 mg
Blister tape, 180-mm reel, PU: 4000 or 2000 pcs, depending on chip thickness
Climatic category (IEC 60068-1)
Max. power at 25
°
C (on PCB)
Resistance tolerance
Rated temperature
B
value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
R
25
No. of
R/T
characteristic
1308
1309
1309
1010
1008
1008
2003
2001
2001
B
25/50
K
3010
3430
3430
3470
3480
3480
3930
3860
3860
P
25
∆
R
N
/R
N
T
N
∆
B/B
δ
th
1)
τ
c
1)
C
th
1)
B
25/85
K
3040
3500
3500
3510
3550
3550
3960
3890
3890
55/125/21
300
±
5 %,
±
10 %,
±
20 %
25
±
3%
approx. 5
approx. 10
approx. 50
B
25/100
K
3060
3520
3520
3530
3560
3560
3980
3920
3920
B57621C0222+062
B57621C0332+062
B57621C0472+062
B57621C0103+062
B57621C0153+062
B57621C0223+062
B57621C0333+062
B57621C0473+062
B57621C0683+062
mW
°
C
mW/K
s
mJ/K
Ordering code
Ω
2,2 k
3,3 k
4,7 k
10 k
15 k
22 k
33 k
47 k
68 k
+: J for
∆
R
N
/R
N
=
±
5 %
K for
∆
R
N
/R
N
=
±
10 %
M for
∆
R
N
/R
N
=
±
20 %
60
05/02
1) Depends on mounting situation
Temperature Measurement
SMD NTC Thermistors with Silver Palladium Termination, Size 1206
B57621
C 621
R
25
No. of
R/T
characteristic
4901
2903
2903
1014
1014
B
25/50
K
3870
4120
4120
4090
4090
B
25/85
K
3930
4190
4190
4210
4210
B
25/100
K
3950
4200
4200
4250
4250
Ordering code
Ω
100 k
150 k
220 k
330 k
470 k
B57621C0104+062
B57621C0154+162
B57621C0224+062
B57621C0334+062
B57621C0474+062
+: J for
∆
R
N
/R
N
=
±
5 %
K for
∆
R
N
/R
N
=
±
10 %
M for
∆
R
N
/R
N
=
±
20 %
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Standard
IEC
60068-2-2
JIS C 0021
IEC
60068-2-3
JIS C 0022
IEC
60068-2-14
JIS C 0025
Test conditions
Storage at upper
category temperature
T:
(125
±
2)
°
C
t:
1000 h
Temperature of air: (40
±
2)
°
C
Relative humidity of air:
(93 +2/–3) %
Duration: 21 days
∆
R
25
/R
25
(typical)
<3%
Remarks
Storage in damp
heat, steady state
<3%
No visible
damage
Rapid temperature
cycling
Endurance
Lower test temperature: – 55
°
C < 3 %
Upper test temperature: 125
°
C
Number of cycles: 10
P
max
: 300 mW
T:
(65
±
2)
°
C
t:
1000 h
<5%
Solderability
IEC
60068-2-58
JIS C 0054
Solderability:
(215
±
3)
°
C / (3
±
0,3) s
(235
±
5)
°
C / (2
±
0,2) s
Resistance to soldering heat:
(260
±
5)
°
C / (10
±
1) s
95 % of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
<5%
61
05/02
Herausgegeben von EPCOS AG
Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND
++49 89 636 09, FAX (0 89) 636-2 26 89
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++49 89 636 09, FAX (0 89) 636-2 26 89
EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
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