IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Differential output | YES |
| Number of drives | 2 |
| High level input current maximum value | 0.00004 A |
| JESD-30 code | R-XDIP-T16 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Minimum output swing | 2 V |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum receive delay | |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| maximum transmission delay | 25 ns |
| DS7832JB | DS8832J4 | DS7832W | DS7832FKB | |
|---|---|---|---|---|
| Description | IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,16PIN,CERAMIC | IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,16PIN,CERAMIC | IC,LINE DRIVER,2 DRIVER,BIPOLAR,FP,16PIN,CERAMIC | IC,LINE DRIVER,2 DRIVER,BIPOLAR,LLCC,20PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Reach Compliance Code | _compli | not_compliant | not_compliant | _compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Differential output | YES | YES | YES | YES |
| Number of drives | 2 | 2 | 2 | 2 |
| High level input current maximum value | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 | S-XQCC-N20 |
| Number of terminals | 16 | 16 | 16 | 20 |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C |
| Minimum output swing | 2 V | 2 V | 2 V | 2 V |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DFP | QCCN |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | FL16,.3 | LCC20,.35SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| maximum transmission delay | 25 ns | 25 ns | 25 ns | 25 ns |
| package instruction | DIP, DIP16,.3 | - | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |